Title:
AIR POCKET-TYPE HOT-WATER FLOORING PANEL
Document Type and Number:
WIPO Patent Application WO/2012/144729
Kind Code:
A2
Abstract:
The present invention relates to a flooring material for a Korean underfloor heating system, and more particularly, to a flooring panel consisting of an extruded resin plate. A plurality of passages and air pockets are integrally formed in a lattice shape in the flooring panel, and hot water is caused to flow through passage joints so as to effectively perform cooling and heating. By forming air pockets, heat-insulation effects can be achieved, and noise between the floors of a building, which causes problems between the floors of a building, can also be reduced. The passage joints are formed into two different types, and screw threads are formed opposite one another, so as to enable two sheets of panels to be coupled together or separated using one nut, thereby minimizing the risk of leakage. A concavo-convex coupling structure is formed for coupling one panel to another, and a drill bit groove is formed in a recessed surface so as to enable the panel to be fixed to a plywood board thereunder using a drill bit, such that assembly and construction can be simply and quickly carried out, thereby significantly reducing costs.
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Inventors:
PARK SANG EON (KR)
Application Number:
PCT/KR2012/001341
Publication Date:
October 26, 2012
Filing Date:
February 22, 2012
Export Citation:
Assignee:
PARK SANG EON (KR)
International Classes:
F24D3/12; F24D19/00
Foreign References:
| KR100712826B1 | 2007-05-07 | |||
| JPS6096518U | 1985-07-01 | |||
| KR20040004313A | 2004-01-13 | |||
| JP2002276959A | 2002-09-25 | |||
| KR200344928Y1 | 2004-03-19 |
Attorney, Agent or Firm:
HONG, Byung Eui (KR)
홍병의 (KR)
홍병의 (KR)
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