Title:
ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/218876
Kind Code:
A1
Abstract:
The present invention provides: an alkali-soluble resin that can give highly solvent-resistant cured products even under low-temperature curing conditions and can be suitably used for various applications such as color filters; and a photosensitive resin composition containing said resin. The present invention pertains to an alkali-soluble resin having a specific structure of an epoxy group-containing structure, a carboxyl group-containing structure, and a polymerizable unsaturated bond-containing structure, and having an epoxy equivalent weight of 50000 g/eq or less.
Inventors:
OTSUKI NOBUAKI (JP)
TERADA TAKUMA (JP)
TERADA TAKUMA (JP)
Application Number:
PCT/JP2023/015488
Publication Date:
November 16, 2023
Filing Date:
April 18, 2023
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
International Classes:
C08G59/17; C08F290/14; C08F299/02; G03F7/027
Domestic Patent References:
| WO2009025190A1 | 2009-02-26 | |||
| WO2022107508A1 | 2022-05-27 | |||
| WO2001053890A1 | 2001-07-26 |
Foreign References:
| JP2012159657A | 2012-08-23 | |||
| JP2009116110A | 2009-05-28 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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