ALLOY MATERIAL FOR DISSIPATING HEAT FROM SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION THEREOF

Title:

ALLOY MATERIAL FOR DISSIPATING HEAT FROM SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION THEREOF

Document Type and Number:

WIPO Patent Application WO/2006/112063

Kind Code:

A1

Abstract:

Provided are an alloy material for heat dissipation which can be produced at a low cost, exhibits a heat expansion coefficient as low as that of a conventional composite material and a heat conductivity as great as that of pure copper, and further is excellent in machinability; and a method for producing the alloy material. In particular, since various shapes are required for an alloy material for heat dissipation, a production method using a powder sintering method, which can supply alloy materials for heat dissipation having various shapes at a low production cost is also provided in addition to a conventional melting method. A Cu-Cr alloy which comprises 0.3 to 80 mass % of Cr and a balanced amount of Cu and inevitable impurities, and has a structure wherein a particulate Cr phases having a longer diameter of 100 nm or less and an aspect ratio of less than 10 are precipitated in a density of 20 pieces/μm² or higher in a Cu matrix except a Cr phase having a diameter of 100 nm or more.

Inventors:

KOBIKI HIDEAKI (JP)
UENOSONO SATOSHI (JP)

Application Number:

PCT/JP2005/018741

Publication Date:

October 26, 2006

Filing Date:

October 05, 2005

Export Citation:

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Assignee:

JFE PREC CORP (JP)
JFE STEEL CORP (JP)
TERAO HOSHIAKI (JP)
KOBIKI HIDEAKI (JP)
UENOSONO SATOSHI (JP)

International Classes:

C22F1/08; B22F3/26; C22C1/04; C22C9/00; C22C27/06; C22F1/11

Foreign References:

JP2000208685A	2000-07-28
JPH108166A	1998-01-13
JPH04198439A	1992-07-17
US5798008A	1998-08-25
EP0903760A2	1999-03-24
JP2002309325A	2002-10-23
JPH06235035A	1994-08-23
JPS63149344A	1988-06-22
JPH03158431A	1991-07-08
JPH0517789A	1993-01-26
JPH04110429A	1992-04-10
JPH05117789A	1993-05-14

Other References: