POLYAMIDE/POLYPHENYLENE ETHER RESIN COMPOSITION

Title:

POLYAMIDE/POLYPHENYLENE ETHER RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2006/112058

Kind Code:

A1

Abstract:

A resin composition characterized by containing polyamide (A), polyphenylene ether (B), elastomer (C) and phosphorus compound (D) selected from among phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypophosphites and phosphoric esters wherein per 100 mass% of the sum of components (A) to (D), phosphorus element is contained in an amount of 1 to 35 ppm. Further, there is provided a molding of the resin composition. Application can be found in a wide spectrum of fields, such as electrical/electronic parts, OA parts, vehicle parts and mechanical parts. In particular, suitable application can be found in exterior parts of automobile, etc. wherein large moldings are required.

Inventors:

TERADA KAZUNORI (JP)
NODA KAZUYA (JP)

Application Number:

PCT/JP2005/017787

Publication Date:

October 26, 2006

Filing Date:

September 28, 2005

Export Citation:

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Assignee:

ASAHI KASEI CHEMICALS CORP (JP)
TERADA KAZUNORI (JP)
NODA KAZUYA (JP)

International Classes:

C08L77/00; C08K13/02; C08L71/12; C08K3/18; C08K3/32; C08K5/51

Foreign References:

JP2005298546A	2005-10-27
JP2005281616A	2005-10-13
JP2004107488A	2004-04-08
JP2004043812A	2004-02-12
JP2741795B2	1998-04-22
JPH09124930A	1997-05-13
JP2004256827A	2004-09-16

Other References: