Title:
Alternate Plating and Etching Processes for Through Hole Filling
Document Type and Number:
WIPO Patent Application WO/2018/161367
Kind Code:
A1
Abstract:
A method for filling a through hole (TH) located on a substrate is provided. The TH is a continuous channel having an upper rim, a lower rim and an interior surface. In one embodiment, the method comprises steps (a)-(d). In the step (a), a conductive material (CM) is deposited over the substrate to thereby deposit a layer of the CM around the rims and on the interior surface. In the step (b), the deposited CM is etched. In particular, the etching step selectively removes more CM deposited at the rims relative to CM deposited at a mid-section of the interior surface of the channel. In the step (c), the steps (a) and (b) are optionally repeated until the channel is sealed at the mid-section by a bridge formed of CM. In the step (d), the CM is further deposited over the substrate to thereby completely fill the TH.
Inventors:
SUN YAOFENG (CN)
XU SHA (CN)
YAU SHUKIN (CN)
XU SHA (CN)
YAU SHUKIN (CN)
Application Number:
PCT/CN2017/076871
Publication Date:
September 13, 2018
Filing Date:
March 16, 2017
Export Citation:
Assignee:
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD (CN)
International Classes:
H01L21/00
Foreign References:
| US20050064707A1 | 2005-03-24 | |||
| CN103219278A | 2013-07-24 | |||
| CN103594386A | 2014-02-19 | |||
| CN105683406A | 2016-06-15 | |||
| US20130149864A1 | 2013-06-13 | |||
| CN102412195A | 2012-04-11 |
Attorney, Agent or Firm:
CHINA TRUER IP (CN)
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