Title:
ALUMINUM ALLOY EXTRUDED MATERIAL AND ELECTRONIC DEVICE HOUSING COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/013956
Kind Code:
A1
Abstract:
An aluminum alloy extruded material and an electronic device housing comprising same are disclosed. According to various embodiments, the aluminum alloy extrusion material comprises aluminum, zinc, magnesium, and copper, and the amounts of copper and zinc have a correlation. Various other embodiments are also possible.
Inventors:
JEONG JINHWAN (KR)
CHOI JUNGWOO (KR)
CHO SUNGHO (KR)
BAEK SEUNGCHANG (KR)
LEE YOONHEE (KR)
YOON BYOUNGUK (KR)
CHOI JUNGWOO (KR)
CHO SUNGHO (KR)
BAEK SEUNGCHANG (KR)
LEE YOONHEE (KR)
YOON BYOUNGUK (KR)
Application Number:
PCT/KR2022/011031
Publication Date:
February 09, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
C22C21/10; B21B1/02; C21D8/02; C21D9/46; C22C1/02; C22F1/053; C25D11/04; C25D11/08; C25D11/10
Foreign References:
| KR20200042919A | 2020-04-24 | |||
| KR20210005998A | 2021-01-15 | |||
| KR20210044205A | 2021-04-22 | |||
| KR101642850B1 | 2016-07-27 | |||
| US20180347017A1 | 2018-12-06 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
Download PDF: