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Title:
ALUMINUM ALLOY WIRE
Document Type and Number:
WIPO Patent Application WO/2010/082670
Kind Code:
A1
Abstract:
Disclosed is an aluminum alloy wire which has an alloy composition that contains 0.1-0.4 mass% of Fe, 0.1-0.3 mass% of Cu, 0.02-0.2 mass% of Mg and 0.02-0.2 mass% of Si, while containing 0.001-0.01 mass% of Ti and V in total, with the balance made up of Al and unavoidable impurities. The aluminum alloy wire has a crystal grain size of 5-25 μm in a vertical cross-section in the wire drawing direction, and an average creep rate for 1-100 hours of 1 × 10-3 (%/hour) or less as determined by a creep test at 150°C with a load of 20% of the 0.2% proof stress.

Inventors:
SEKIYA SHIGEKI (JP)
MIHARA KUNITERU (JP)
SUSAI KYOTA (JP)
Application Number:
PCT/JP2010/050576
Publication Date:
July 22, 2010
Filing Date:
January 19, 2010
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
SEKIYA SHIGEKI (JP)
MIHARA KUNITERU (JP)
SUSAI KYOTA (JP)
International Classes:
C22C21/00; H01B1/02; H01B5/08; H01B7/00; C22F1/04
Domestic Patent References:
WO2006085638A12006-08-17
Foreign References:
JP2004134212A2004-04-30
JP2006019164A2006-01-19
JPS4823609B11973-07-14
JPS4943162B11974-11-19
JPS4978616A1974-07-29
JP2003105468A2003-04-09
JP2004311102A2004-11-04
JP2006012468A2006-01-12
JP3530181B12004-05-24
JP2005336549A2005-12-08
JP2004134212A2004-04-30
JP2005174554A2005-06-30
JP2006019164A2006-01-19
JP2006079885A2006-03-23
JP2006019165A2006-01-19
JP2006019163A2006-01-19
JP2006253109A2006-09-21
JP2006079886A2006-03-23
JP2000357420A2000-12-26
Other References:
"High Temperature Creep Property of Aluminum Dilute Binary Alloy", LIGHT METAL, vol. 19, no. 7, 1969, pages 310 - 315
"Effect of Load Retention Time on Hardness of Aluminum Alloy and Room Temperature", LIGHT METAL, vol. 34, no. 1, 1984, pages 8 - 13
See also references of EP 2383357A4
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
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