Title:
ALUMINUM DEPOSIT FORMED BY PLATING, METALLIC MEMBER, AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/001717
Kind Code:
A1
Abstract:
An aluminum deposit formed by electroplating which, before anodic oxidation, is sufficiently hard and which is less apt to be marred during handling; and a process for producing the aluminum deposit. The aluminum deposit formed by plating has an aluminum content of 98 wt.% or lower and a Vickers hardness of 250 or higher. The deposit contains oxygen, carbon, sulfur, and a halogen element as impurities and, hence, has the enhanced hardness. The concentration of such impurities in the deposit can be determined by regulating current density, plating temperature, solution composition, etc.
Inventors:
HOSHI HIROYUKI (JP)
OKAMOTO ATSUSHI (JP)
ANDOU SETSUO (JP)
OKAMOTO ATSUSHI (JP)
ANDOU SETSUO (JP)
Application Number:
PCT/JP2007/062686
Publication Date:
January 03, 2008
Filing Date:
June 25, 2007
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
HOSHI HIROYUKI (JP)
OKAMOTO ATSUSHI (JP)
ANDOU SETSUO (JP)
HOSHI HIROYUKI (JP)
OKAMOTO ATSUSHI (JP)
ANDOU SETSUO (JP)
International Classes:
C25D3/66
Foreign References:
| JP2006161154A | 2006-06-22 | |||
| JP2005031485A | 2005-02-03 | |||
| JP2001040496A | 2001-02-13 | |||
| JPH10144159A | 1998-05-29 | |||
| JP2006161154A | 2006-06-22 | |||
| JP2004076031A | 2004-03-11 | |||
| JP2004346372A | 2004-12-09 | |||
| EP1591551A1 | 2005-11-02 | |||
| JPH11343555A | 1999-12-14 | |||
| US4257854A | 1981-03-24 |
Other References:
S. BIRKLE, ERLANGEN: "Metalloberflache", CARL HANSER VERLAG, article "Elektrochemische Al-Abscheidung"
See also references of EP 2037007A4
See also references of EP 2037007A4
Attorney, Agent or Firm:
HORI, Shiroyuki et al. (3-3-1 Kasumigaseki, Chiyoda-k, Tokyo 13, JP)
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