Title:
ALUMINUM-DIAMOND COMPOSITE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/065139
Kind Code:
A1
Abstract:
The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor element, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element. Provided is a flat plate-shaped aluminum-diamond composite that has an aluminum-diamond composite part and a surface layer that coats both surfaces of the composite part and includes a metal that has aluminum as a principal component, wherein: the composite part is composed of a composite material that is composed of an aluminum or aluminum alloy matrix and diamond particles dispersed in said matrix; the composite material is composed of a diamond powder in which diamond particles having a particle size of 1-20 μm, inclusive, make up 10-40 vol% of the diamond particles and diamond particles having a particle size of 100-250 μm, inclusive, make up 50-80 vol%, said powder not containing diamond particles having a particle size of less than 1 μm or diamond particles having a particle size of more than 250 μm; and the average value for the differences in in-plane thickness per 50 mm×50 mm is 100 μm or less.
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Inventors:
OTA HIROAKI (JP)
MIYAKAWA TAKESHI (JP)
ISHIHARA YOSUKE (JP)
MIYAKAWA TAKESHI (JP)
ISHIHARA YOSUKE (JP)
Application Number:
PCT/JP2016/080146
Publication Date:
April 20, 2017
Filing Date:
October 11, 2016
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C22C26/00; C04B41/88; C22C21/00; C22F1/00; C22F1/043
Domestic Patent References:
| WO2013015158A1 | 2013-01-31 | |||
| WO2016035789A1 | 2016-03-10 |
Foreign References:
| JP2012158817A | 2012-08-23 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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