Title:
ANTENNA MODULE
Document Type and Number:
WIPO Patent Application WO/2023/135912
Kind Code:
A1
Abstract:
According to the present invention, a sub-module includes a plurality of electronic components and a first support member. The plurality of electronic components include a plurality of respective internal terminals. The first support member covers and supports the plurality of electronic components such that the plurality of internal terminals are exposed. A first conductive film is provided to at least a portion of the first support member. A second support member supports the sub-module as well as an antenna. A plurality of external terminals that are exposed from the second support member are respectively connected to the plurality of internal terminals.
Inventors:
YOKOYAMA MICHIHARU (JP)
NEMOTO TAKAYA (JP)
UEDA HIDEKI (JP)
NEMOTO TAKAYA (JP)
UEDA HIDEKI (JP)
Application Number:
PCT/JP2022/041396
Publication Date:
July 20, 2023
Filing Date:
November 07, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q23/00; H01L25/04; H01L25/18; H01Q1/40; H01Q1/52; H01Q21/28
Domestic Patent References:
| WO2020153068A1 | 2020-07-30 | |||
| WO2015015863A1 | 2015-02-05 |
Foreign References:
| JP2021048386A | 2021-03-25 |
Attorney, Agent or Firm:
KITAYAMA Mikio et al. (JP)
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