Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2023/135911
Kind Code:
A1
Abstract:
In the present invention, a plurality of submodules each include a plurality of electronic components which each include a plurality of internal terminals. A first support member covers and supports the plurality of electronic components so that the plurality of internal terminals are exposed. A second support member supports the plurality of submodules. A plurality of external terminals of the plurality of submodules are respectively connected to the plurality of internal terminals, and are exposed from the second support member. At least one submodule among the plurality of submodules has a first electroconductive film which is provided in at least one region of the first support member.

Inventors:
YOKOYAMA MICHIHARU (JP)
NEMOTO TAKAYA (JP)
UEDA HIDEKI (JP)
Application Number:
PCT/JP2022/041395
Publication Date:
July 20, 2023
Filing Date:
November 07, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L23/00; H01L23/02; H01L23/28; H01L23/31; H01L25/00
Domestic Patent References:
WO2008136251A12008-11-13
WO2018105307A12018-06-14
Foreign References:
US20170148744A12017-05-25
US20190244907A12019-08-08
US20200020643A12020-01-16
JP2021106341A2021-07-26
US20180138148A12018-05-17
US20150084206A12015-03-26
JP2013179449A2013-09-09
JP2013179152A2013-09-09
Attorney, Agent or Firm:
KITAYAMA Mikio et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: IMAGE-CAPTURING DEVICE, IMAGE-CAPTURING METHOD, AND PROGRAM

Next Patent: ANTENNA MODULE