Title:
ANTI-SCAVENGING SOLDERS FOR SILVER METALLIZATION AND METHOD
Document Type and Number:
WIPO Patent Application WO2001072466
Kind Code:
A3
Abstract:
Solder and a method of manufacturing the solder are disclosed wherein powdered free silver (15) is added to a solder alloy (12) with a particle size sufficient to preserve silver metallization during use and with a concentration sufficient to maximize the effectiveness and avoid adverse effects on solder reflow characteristics. Preferably, the particle size is in a range of approximately 5 mu m to 20 mu m and the powdered free silver is added in a concentration of approximately 5 % to 10 %.
Inventors:
HUANG RONG-FONG
SHANG JIAN-KU
MIESEM ROSS A
SHANG JIAN-KU
MIESEM ROSS A
Application Number:
PCT/US2001/009316
Publication Date:
January 31, 2002
Filing Date:
March 22, 2001
Export Citation:
Assignee:
MOTOROLA INC (US)
International Classes:
B23K35/02; B23K35/14; (IPC1-7): B23K35/26; B23K35/14
Foreign References:
| EP0110307A2 | 1984-06-13 | |||
| US4740252A | 1988-04-26 | |||
| US2431611A | 1947-11-25 | |||
| DE19743886A1 | 1999-04-08 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 014, no. 502 (E - 0997) 2 November 1990 (1990-11-02)
PATENT ABSTRACTS OF JAPAN vol. 013, no. 405 (M - 868) 7 September 1989 (1989-09-07)
PATENT ABSTRACTS OF JAPAN vol. 013, no. 405 (M - 868) 7 September 1989 (1989-09-07)
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