APPARATUS FOR CONTACTLESS TRANSPORTATION OF A CARRIER IN A DEPOSITION SYSTEM, SYSTEM FOR CONTACTLESS TRANSPORTATION OF A CARRIER, CARRIER FOR CONTACTLESS TRANSPORTATION IN A DEPOSITION SYSTEM, AND METHOD FOR CONTACTLESS

TRANSPORTATION OF A CARRIER IN A DEPOSITION SYSTEM

FIELD

[0001] Embodiments of the present disclosure relate to an apparatus for contactless transportation of a carrier in a deposition system, a system for contactless transportation of a carrier, a carrier for contactless transportation in a deposition system, and a method for contactless transportation of a carrier in a deposition system. Embodiments of the present disclosure particularly relate to an electrostatic chuck (E-chuck) for holding substrates and/or masks used in the manufacture of organic light-emitting diode (OLED) devices.

BACKGROUND

[0002] Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates may be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, and the like for displaying information. An OLED device, such as an OLED display, may include one or more layers of an organic material situated between two electrodes that are all deposited on a substrate.

[0003] During processing, the substrate can be supported on a carrier configured to hold the substrate and an optional mask. The carrier can be contactlessly transported inside a deposition system, such as a vacuum deposition system, using magnetic forces. For applications such as organic light emitting devices, a purity and uniformity of the organic layers deposited on the substrate should be high. Further, handling and transportation of the carriers supporting substrates and masks using contactless transportation without sacrificing the throughput due to substrate breakage is challenging. [0004] In view of the above, new apparatuses for contactless transportation of a carrier in a deposition system, systems for contactless transportation of a carrier, carriers for contactless transportation in a deposition system, and methods for contactless transportation of a carrier in a deposition system that overcome at least some of the problems in the art are beneficial. The present disclosure particularly aims at providing carriers that can be efficiently and smoothly transported in a deposition system, such as a vacuum deposition system.

SUMMARY [0005] In light of the above, an apparatus for contactless transportation of a carrier in a deposition system, a system for contactless transportation of a carrier, a carrier for contactless transportation in a deposition system, and a method for contactless transportation of a carrier in a deposition system are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0006] According to an aspect of the present disclosure, an apparatus for contactless transportation of a carrier in a deposition system is provided. The apparatus includes a drive structure for moving the carrier in a transport direction, and a position detection device at the drive structure. [0007] According to a further aspect of the present disclosure, a system for contactless transportation of a carrier is provided. The system includes the apparatus for contactless transportation of a carrier according to the present disclosure and the carrier.

[0008] According to another aspect of the present disclosure, a carrier for contactless transportation in a deposition system is provided. The carrier includes a magnet structure configured to magnetically interact with a drive structure of the deposition system for moving the carrier in a transport direction, and a position detection device.

[0009] According to an aspect of the present disclosure, a method for contactless transportation of a carrier in a deposition system is provided. The method includes generating at least one signal indicating at least one of a position and a speed of the carrier using a position detection device at a drive structure or on the carrier, and controlling at least one active magnet unit of one or more first active magnet units of the deposition system based on the at least one signal.

[0010] According to another aspect of the present disclosure, an apparatus for contactless transportation of a carrier in a deposition system is provided. The apparatus includes at least one guide unit. The at least one guide unit includes an active magnet unit and two or more distance sensors. The active magnet unit is arranged between the two or more distance sensors.

[0011] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1 shows a schematic view of a carrier and a guiding structure;

FIG. 2 shows a schematic view of an apparatus for contactless transportation and a carrier according to embodiments described herein; FIG. 3 show schematic views of an apparatus for contactless transportation and a carrier according to further embodiments described herein;

FIGs. 4A and B show schematic views of an apparatus for contactless transportation and a carrier according to embodiments described herein;

FIG. 5 shows a schematic view of a system for substrate processing according to embodiments described herein;

FIG. 6 shows a schematic view of a system for substrate processing according to further embodiments described herein; and

FIG. 7 shows a flow chart of a method for contactless transportation of a carrier in a deposition system according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0013] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0014] Carriers can be used in a deposition system, such as a vacuum deposition system, for holding and transporting substrates and/or masks within a deposition chamber of the deposition system. For example, one or more material layers can be deposited on the substrate while the substrate is supported on the carrier. For applications such as organic light emitting devices, a high purity and uniformity of the organic layers deposited on the substrate can be beneficial. Further, a smooth transportation of the carrier inside the deposition system is beneficial e.g. in order to reduce substrate breakage. [0015] According to the embodiments of the present disclosure, a position detection device, such as an encoder or a resolver, is used to determine a position and/or a speed of the carrier in the deposition system. In some examples, the position detection device can be provided at a drive structure of a transport arrangement of the deposition system. In further examples, the position detection device can be provided at the carrier so as to be transported together with the carrier. The position and/or a speed of the carrier can be used to selectively control the transport arrangement, such as active magnet units used to levitate the carrier. A smoot transportation of the carrier can be achieved.

[0016] FIG. 1 shows a schematic view of a carrier 100 and a portion of a transport arrangement configured for contactless transportation of the carrier 100 in a transport direction 1, which can be a horizontal direction.

[0017] The transport arrangement includes a guiding structure 110, which can be an active guiding structure. The guiding structure 110 includes a plurality of guide units 111, which are arranged along the transport direction 1. Each guide unit 111 includes an (e.g. electromagnetic) actuator, such as an active magnet unit 112, and a controller 114 configured to control the actuator, and a distance sensor (not shown) configured to measure a gap to the carrier 100. The guiding structure 110 can be configured to contactlessly levitate the carrier 100 using magnetic forces.

[0018] When the carrier 100 approaches or leaves a guide unit 111, a levitation accuracy and/or levitation stability can be affected. In particular, a considerable and/or pulse-like force, which may lead to a sudden acceleration or deceleration of the carrier 100, can be generated when the carrier 100 approaches or leaves a guide unit 111. The force may depend on the geometrical arrangement and configuration of the components of the guiding structure 110, and particularly of the plurality of guide units 111 (e.g. the electromagnetic actuator(s) and the distance sensor(s)). The force can lead to unwanted and sudden movements of the carrier 100, and may even lead to an accidental mechanical contact between the carrier 100 and the guiding structure 110. The carrier 100, the substrate and/or the guiding structure 110 can be damaged. Further, particles may be generated, which deteriorate a quality of a deposition process.

[0019] The pulse-like force or change of force in the direction of the levitating force, and particularly in the direction (e.g., the vertical direction 3) of a magnetic force provided by the actuator, may occur when the carrier 100 suddenly disappears e.g. from below the distance sensor. This may result in a signal value at the distance sensor which is the same as if the carrier would perform a fast movement away from the distance sensor in the distance (or measurement) direction, such as the vertical direction 3. In other words, the distance sensor indicates a gap enlargement. The signal change can make the controller to strongly change the actuator force to bring the "moving" carrier 100 back to a set distance between the guiding structure 110 and the carrier 100.

[0020] Moreover, when the carrier 100 approaches or leaves a guide unit 111, a force component along the transport direction 1 can be generated. The force component may even be strong enough to hinder a further transport of the carrier 100. The force component along the transport direction 1 can originate from the actuator's reluctance acting on the front face and/or rear face (e.g., the leading edge or trailing edge) of the carrier. This is exemplarily illustrated in FIG. 1 by the magnetic field lines at the rear face of the carrier 100. [0021] FIG. 2 shows a schematic view of an apparatus for contactless transportation of a carrier 220 in a deposition system according to embodiments described herein.

[0022] The apparatus includes a drive structure 210 for moving the carrier 220 in a transport direction 1 and a position detection device, such as an encoder device 215. In one example, the position detection device is provided at the drive structure 210 and can be a stationary part of the transport arrangement of the deposition system. In another example, the carrier 220 includes the position detection device. In particular, the position detection device can be mounted on the carrier 220 so as to move together with the carrier 220. The carrier 220 can have a first end 201 and an a second end 202. The first end can be a leading edge of the carrier 220, and the second end can be a trailing edge of the carrier 220. [0023] According to some embodiments, which can be combined with other embodiments described herein, the position detection device can be configured to provide information about a position and/or a speed of the carrier. In some examples, the position detection device can be an encoder or resolver. The terms "position detection device", "encoder", "encoder device", and "resolver" as used throughout the present disclosure are to be understood in the sense of a device capable of providing positional information about the carrier, such as an absolute position in the deposition system, a relative position e.g. with respect to the guiding structure, and/or a speed of the carrier. In some embodiments, the position of the carrier, such as the absolute position and/or the relative position, can be obtained using a speed or speed profile and a reference point, such as a start point of the carrier.

[0024] In some implementations, the position detection device may use one or more operation parameters of the drive structure to obtain e.g. additional information about the position and/or the speed of the carrier. The one or more operation parameters can include, but are not limited to, an operating power, such as a current flowing through one or more second active magnet units of the drive structure.

[0025] The carrier 220 is configured for contactless transportation through one or more chambers, such as vacuum chamber, of the deposition system, and in particular through at least one deposition area, along a transportation path such as a linear transportation path. The carrier 220 can be configured for contactless transportation in the transport direction 1, which can be a horizontal direction.

[0026] According to some embodiments, which can be combined with other embodiments described herein, the deposition system may include the transport arrangement configured for contactless levitation and/or contactless transportation of the carrier 220 in the deposition system. In some implementations, the apparatus, and in particular the transport arrangement, includes a guiding structure 230 for levitating the carrier 220 and the drive structure 210 for moving the carrier 220 in the transport direction 1.

[0027] The guiding structure 230 can have one or more first active magnet units 112 configured to magnetically interact with a first magnet structure 222 of the carrier 220. The first magnet structure 222 may be comprised of one or more first magnet units configured to magnetically interact with the guiding structure 230. In some implementations, the one or more first magnet units can be passive magnet units, such as permanent magnets unit and/or ferromagnetic parts. [0028] According to some embodiments, which can be combined with other embodiments described herein, the carrier 220 includes a second magnet structure comprised of one or more second magnet units (not shown) configured to magnetically interact with the drive structure 210 for moving the carrier 220 in the transport direction 1. In some implementations, the one or more second magnet units can be passive magnet units, such as ferromagnets. The guiding structure 230 and the drive structure 210 can be arranged at opposite ends or end portions of the carrier 220. Specifically, the one or more first magnet units and the one or more second magnet units can be arranged at opposite ends or end portions of the carrier 220.

[0029] The deposition system, and particularly the transport arrangement, can include the guiding structure 230 having the plurality of guide units 111. Each guide unit 111 may include an actuator, such as a first active magnet unit 112, a unit controller 114 configured to control the actuator, and optionally a distance sensor 118 configured to sense or measure the gap between the magnet structure, and in particularly the one or more first magnet units thereof, and the actuator. The gap can be measured in a direction perpendicular to the transport direction 1, such as the vertical direction 3 or a horizontal direction 2. In particular, the distance sensor 118 can be arranged to face the one or more first magnet units e.g. when the carrier 220 is at the distance sensor 118 to sense or measure the gap between the one or more first magnet units and the first active magnet unit 112.

[0030] The unit controller 114 can be configured to control the first active magnet unit 112 to adjust the magnetic force provided by the first active magnet unit 112 based on information provided by the encoder device 215 and optionally based on information provided by the distance sensor 118. In particular, the unit controller 114 can be configured to control the first active magnet unit 112 such that the distance between the one or more first magnet units and the active magnet unit 112 is essentially constant while the carrier 220 is transported through the deposition system. Although FIG. 2 exemplarily illustrates that each guide unit 111 has a unit controller, it is to be understood that the present disclosure is not limited thereto and that a unit controller can be allocated to two or more guide units. For example, one single unit controller can be provided for all guide units.

[0031] According to some embodiments, which can be combined with other embodiments described herein, the apparatus includes a controller 240 (also referred to as "system controller" or "main controller") configured to control the guiding structure 230 and/or the drive structure 210. The controller 240 can be wirelessly or wiredly connected to the drive structure 210, and particularly to the encoder device 215. In some embodiments, the controller 240 can be connected to the guiding structure 230, for example, via a bus 242. In particular, the controller 240 can be connected to each of the unit controllers 114 of the guide units 111. The controller 240 can be configured to provide control signals or instructions to the unit controllers 114 of the guide units 111 for controlling the guiding structure 230. The bus 242 can be wire-based or can be wireless.

[0032] In some implementations, the controller 240 can be configured to selectively control the one or more first active magnet units 112 based on one or more input signals. For example, the controller 240 can send control signals to the unit controllers 114 to control the one or more first active magnet units 112. The one or more input signals can be provided by the encoder device 215 and/or the distance sensor(s) 118. For example, the encoder device 215 can be configured to provide at least one first input signal of the one or more input signals. The at least one first input signal can indicate at least one of a position and a speed of the carrier 220 in the deposition system. Additionally or alternatively, the one or more distance sensors 118 can be configured to provide at least one second input signal of the one or more input signals. The at least one second input signal can indicate the gap between the one or more first active magnet units 112 and the carrier 220.

[0033] According to some embodiments, which can be combined with other embodiments described herein, the unit controller 114 of a guide unit 111 can deactivate the first active magnet unit 112 before the first active magnet unit 112 and/or the distance sensor 118 "leaves" the respective trail on the carrier 220 based on positional information provided by the encoder device 215 and optionally based on gap information provided by the distance sensor 118. Optionally or alternatively, the unit controller 114 of a guide unit 111 can activate the first active magnet unit 112 only after the first active magnet unit 112 and/or the distance sensor 118 face the respective trails on the carrier 220 based on positional information provided by the encoder device 215 and optionally based on gap information provided by the distance sensor 118. In other words, a first active magnet unit 112 is deactivated before the carrier 220 "leaves" the first active magnet unit 112. Likewise, a deactivated first active magnet unit 112 is only activated after the first active magnet unit 112 and the magnet structure of the carrier overlap. The activation and/or deactivation of first active magnet unit(s) 112 can be stepwise, continuously, or abrupt. The selective activation and/or deactivation can be provided because the encoder device 215 provides information about the position of the carrier 220 in the transport direction 1 in the deposition system. [0034] According to an aspect of the present disclosure, the carrier includes the encoder. In other words, the encoder is not integrated in the transport arrangement but is part of the carrier. The functionalities are essentially the same as described above. In particular, the encoder can be configured to provide at least one signal indicating at least one of a position and a speed of the carrier. The at least one signal may correspond to the at least one first input signal described above. According to some embodiments, the carrier can include a communication device configured to transmit the at least one signal to the deposition system. For example, the communication device can be configured to transmit the at least one signal to the controller 240, e.g., wirelessly or via cables.

[0035] The carrier 220 can be configured to hold a substrate and/or a mask (not shown) used during substrate processing, such as vacuum processing. In some implementations, the carrier 220 can be configured to support both the substrate and the mask. In further implementations, the carrier 220 can be configured to support either the substrate or the mask. In such a case the carrier 220 can be referred to as "substrate carrier" and "mask carrier", respectively. [0036] The carrier 220 can include a support structure or body 225 providing a support surface, which can be an essentially flat surface configured for contacting e.g. a back surface of the substrate. In particular, the substrate can have a front surface (also referred to as "processing surface") opposite the back surface and on which a layer is deposited during the processing, such as a vacuum deposition process. The first magnet structure 222 can be provided at the body 225. [0037] The term "vacuum" as used throughout the present disclosure can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. The pressure in the vacuum chamber may be between 10 - ^" 5 mbar and about 10 - ^" 8 mbar, specifically between 10 - ^" 5 mbar and 10 - ^" 7 mbar, and more specifically between about 10 ^"6 mbar and about 10 ^"7 mbar. One or more vacuum pumps, such as turbo pumps and/or cryo-pumps, connected to the vacuum chamber for generation of the vacuum inside the vacuum chamber can be provided.

[0038] The carrier 220 according to the present disclosure can be an electrostatic chuck (E-chuck) providing an electrostatic force for holding the substrate and/or the mask at the carrier 220. For example, the carrier 220 includes an electrode arrangement configured to provide an attracting force acting on at least one of the substrate and the mask. The electrode arrangement can be embedded in the body 225, or can be provided, e.g., placed, on the body 225. According to some embodiments, which can be combined with other embodiments described herein, the body 225 is a dielectric body, such as a dielectric plate. The dielectric body can be fabricated from a dielectric material, preferably a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or an equivalent material, but may be made from such materials as polyimide. In some embodiments, the electrode arrangement includes a plurality of electrodes, such as a grid of fine metal strips, placed on the dielectric plate and covered with a thin dielectric layer.

[0039] The electrode arrangement, and particularly the plurality of electrodes, can be configured to provide the attracting force, such as a chucking force. The attracting force can be a force acting on the substrate and/or the mask at a certain relative distance between the plurality of electrodes (or the support surface) and the substrate and/or the mask. The attracting force can be an electrostatic force provided by voltages applied to the plurality of electrode arrangement.

[0040] The substrate can be attracted by the attracting force provided by the carrier 220, which can be an E-chuck, towards the support surface (e.g. in a direction perpendicular to the transport direction). The attracting force can be strong enough to hold the substrate e.g. in a vertical position by frictional forces. In particular, the attracting force can be configured to fix the substrate on the support surface essentially immoveable. For example, to hold a 0.5 mm glass substrate in a vertical position using friction forces, an attracting pressure of about 50 to 100 N/m (Pa) can be used, depending on the friction coefficient.

[0041] According to some embodiments, which can be combined with other embodiments described herein, the carrier 220 is configured for holding or supporting the substrate and/or mask in a substantially vertical orientation. In particular, the carrier can be configured for transportation in a vertical orientation. As used throughout the present disclosure, "substantially vertical" is understood particularly when referring to the substrate orientation, to allow for a deviation from the vertical direction or orientation of ±20° or below, e.g. of ±10° or below. This deviation can be provided for example because a substrate support with some deviation from the vertical orientation might result in a more stable substrate position. Further, fewer particles reach the substrate surface when the substrate is tilted forward. Yet, the substrate orientation, e.g., during the deposition process, is considered substantially vertical, which is considered different from the horizontal substrate orientation, which may be considered as horizontal ±20° or below. [0042] The term "vertical direction" or "vertical orientation" is understood to distinguish over "horizontal direction" or "horizontal orientation". That is, the "vertical direction" or "vertical orientation" relates to a substantially vertical orientation e.g. of the carrier and the substrate, wherein a deviation of a few degrees, e.g. up to 10° or even up to 15°, from an exact vertical direction or vertical orientation is still considered as a "substantially vertical direction" or a "substantially vertical orientation". The vertical direction can be substantially parallel to the force of gravity.

[0043] The embodiments described herein can be utilized for evaporation on large area substrates, e.g., for OLED display manufacturing. Specifically, the substrates for which the structures and methods according to embodiments described herein are provided, are large area substrates. For instance, a large area substrate or carrier can be GEN 4.5, which corresponds to a surface area of about 0.67 m ² (0.73 x 0.92m), GEN 5, which corresponds to a surface area of about 1.4 m ² (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m ² (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7m ² (2.2 m x 2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m ² (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half sizes of the GEN generations may also be provided in OLED display manufacturing.

[0044] According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness can be from 0.1 to 1.8 mm. The substrate thickness can be about 0.9 mm or below, such as 0.5 mm. The term "substrate" as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto and the term "substrate" may also embrace flexible substrates such as a web or a foil. The term "substantially inflexible" is understood to distinguish over "flexible". Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[0045] According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass, and the like), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process. [0046] FIG. 3 shows a schematic view of an apparatus for contactless transportation of a carrier in a deposition system according to another aspect of the present disclosure.

[0047] The apparatus includes at least one guide unit 311. For example, a plurality of guide units can be arranged along the transport direction 1 of the carrier 320. The at least one guide unit 311 includes an active magnet unit 312 and two or more distance sensors 318 configured to measure a gap between the active magnet unit 312 and the carrier 320. The active magnet unit 312 is arranged between the two or more distance sensors 318. In particular, the active magnet unit 312 and the two or more distance sensors 318 can be sequentially arranged along the transport direction 1 of the carrier 320. The two or more distance sensors 318 can be essentially identical. [0048] According to some embodiments, the active magnet unit 312 can be controlled based on a comparison of the measurement signals of both sensors. For example, the active magnet unit 312 can be deactivated if the two or more distance sensors 318 give different signals, i.e., if the two or more distance sensors 318 indicate different gaps. Additionally or alternatively, the active magnet unit 312 can be activated if the two or more distance sensors 318 give essentially the same signals, i.e., if the two or more distance sensors 318 indicate essentially identical gaps. In some implementations, it can be determined that the measured gaps are essentially the same when a difference between the measured gaps is equal to or less than a predetermined threshold. It can be determined that the measured gaps are different when a difference between the measured gaps is greater than the predetermined threshold. According to some embodiments, an active magnet unit 312 which the carrier approaches can be activated if the two or more distance sensors 318 give different signals, i.e., if the two or more distance sensors 318 indicate different gaps. In some embodiments, the apparatus can further include the position detection device, such as the encoder or resolver. The active magnet units can be further controller based on the information provided by the position detection device such that a smooth transportation of the carrier in the transport direction can be achieved.

[0049] FIGs. 4A and B show schematic views of an apparatus 400 for contactless transportation of a carrier 410 according to embodiments described herein. The apparatus and the carrier 410 can be configured according to the embodiments described herein.

[0050] The apparatus 400 includes the transport arrangement having the guiding structure 470, which includes the one or more first active magnetic units 475, and the carrier 410 according to the present disclosure. The apparatus 400 may further include a controller configured to selectively control at least one first active magnet unit of the one or more first active magnet units 475 based on data obtained using the encoder. According to some embodiments described herein, the transport arrangement may be arranged in the vacuum chamber of the vacuum system. The vacuum chamber may be a vacuum deposition chamber. However, the present disclosure is not limited to vacuum systems and the carriers and transport arrangements described herein can be implemented in atmospheric environments. [0051] The carrier 410 can include the magnet structure having the one or more first magnet units configured to magnetically interact with the guiding structure 470 of the vacuum system for providing a magnetic levitation force for levitating the carrier 410. The one or more first magnet units can be a first passive magnetic unit 450. The guiding structure 470 may extend in the transport direction 1 of the carrier 410, which can be a horizontal direction. The guiding structure 470 can include the one or more first active magnetic units 475. The carrier 410 can be movable along the guiding structure 470. The first passive magnetic unit 450, e.g. a bar of ferromagnetic material, and the one or more first active magnetic units 475 of the guiding structure 470 can be configured for providing a first magnetic levitation force for levitating the carrier 410. The devices for levitating as described herein are devices for providing a contactless force to levitate e.g. the carrier 410.

[0052] The transport arrangement may further include the drive structure 480. The drive structure 480 can include a plurality of further magnet units, such as one or more second active magnetic units. The carrier 410 can include one or more second magnet units configured to magnetically interact with the drive structure 480. In particular, the one or more second magnet units can be a second passive magnetic unit 460, e.g. a bar of ferromagnetic material, to interact with the one or more second active magnetic units 485 of the drive structure 480. [0053] FIG. 4B shows a side view of the transport arrangement. In FIG. 4B, an active magnetic unit of the plurality of one or more first active magnetic units 475 is shown. The active magnetic unit provides a magnetic force interacting with the first passive magnetic unit 450 of the carrier 410. For example, the first passive magnetic unit 450 can be a rod of a ferromagnetic material. A rod can be a portion of the carrier 410 that is connected to a support structure 412. The support structure 412 can be provided by the body of the carrier 410. The rod or the first passive magnetic unit, respectively, may also be integrally formed with the support structure 412 for supporting the substrate 10. The carrier 410 can further include the second passive magnetic unit 460, for example a further rod. The further rod can be connected to the carrier 410. The rod or the second passive magnetic unit, respectively, may also be integrally formed with the support structure 412. [0054] The terminology of a "passive" magnetic unit is used herein to distinguish from the notion of an "active" magnetic unit. A passive magnetic unit may refer to an element with magnetic properties, which are not subject to active control or adjustment, at least not during operation of the transport arrangement. For example, the magnetic properties of a passive magnetic unit, e.g. the rod or the further rod of the carrier, are not subject to active control during movement of the carrier through the vacuum chamber or vacuum system in general. According to some embodiments, which can be combined with other embodiments described herein, a controller of the transport arrangement is not configured to control a passive magnetic unit. A passive magnetic unit may be adapted for generating a magnetic field, e.g. a static magnetic field. A passive magnetic unit may not be configured for generating an adjustable magnetic field. A passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.

[0055] According to embodiments described herein, the one or more first active magnetic units 475 provide for a magnetic force on the first passive magnetic unit 450 and thus, the carrier 410. The one or more first active magnetic units 475 levitate the carrier 410. The one or more second active magnetic units 485 can drive the carrier 410 within the vacuum chamber, for example along the transport direction 1. The one or more second active magnetic units 485 form the drive structure for moving the carrier 410 in the transport direction 1 while being levitated by the one or more first active magnetic units 475 located above the carrier 410. The one or more second active magnetic units 485 can interact with the second passive magnetic unit 460 to provide a force along the transport direction 1. For example, the second passive magnetic unit 460 can include a plurality of permanent magnets arranged with an alternating polarity. The resulting magnetic fields of the second passive magnetic unit 460 can interact with the one or more second active magnetic units 485 to move the carrier 410 while being levitated.

[0056] In order to levitate the carrier 410 with the one or more first active magnetic units 475 and/or to move the carrier 410 with the one or more second active magnetic units 485, the active magnetic units can be controlled to provide adjustable magnetic fields. The adjustable magnetic field may be a static or a dynamic magnetic field. According to embodiments, which can be combined with other embodiments described herein, an active magnetic unit is configured for generating a magnetic field for providing a magnetic levitation force extending along a vertical direction 3 (e.g. for a vertically oriented carrier) or a horizontal direction 2 (e.g. for a horizontally oriented carrier). According to other embodiments, which can be combined with further embodiments described herein, an active magnetic unit may be configured for providing a magnetic force extending along a transversal direction. An active magnetic unit, as described herein, may be or include an element selected from the group consisting of an electromagnetic device, a solenoid, a coil, a superconducting magnet, or any combination thereof.

[0057] Embodiments described herein relate to contactless levitation, transportation and/or alignment of a carrier, a substrate and/or a mask. The disclosure refers to a carrier, which may include one or more elements of the group consisting of: a carrier supporting a substrate, a carrier without a substrate, a substrate, or a substrate supported by a support. The term "contactless" as used throughout the present disclosure can be understood in the sense that a weight of e.g. the carrier and the substrate is not held by a mechanical contact or mechanical forces, but is held by a magnetic force. Specifically, the carrier is held in a levitating or floating state using magnetic forces instead of mechanical forces. For example, the transport arrangement described herein may have no mechanical devices, such as a mechanical rail, supporting the weight of the carrier. In some implementations, there can be no mechanical contact between the carrier and the rest of the apparatus at all during levitation, and for example movement, of the carrier in the vacuum system.

[0058] According to embodiments of the present disclosure, levitating or levitation refers to a state of an object, wherein the objects floats without mechanical contact or support. Further, moving an object refers to providing a driving force, e.g. a force in a direction different to that of a levitation force, wherein the object is moved from one position to another, different position. For example, an object such as a carrier can be levitated, i.e. by a force counteracting gravity, and can be moved in a direction different then a direction parallel to gravity while being levitated.

[0059] The contactless levitation and transportation of the carrier according to embodiments described herein is beneficial in that no particles are generated due to a mechanical contact between the carrier and sections of the transport arrangement, such as mechanical rails, during the transport or alignment of the carrier. Accordingly, embodiments described herein provide for an improved purity and uniformity of the layers deposited on the substrate, in particular since a particle generation is minimized when using the contactless levitation, transportation and/or alignment. Further, a shock-less and smooth transport of the carrier can be provided and for instance a glass breakage can be reduced or even avoided.

[0060] FIG. 5 shows a system 500 for substrate processing according to embodiments described herein. The system 500, which can be a vacuum system, can be configured for depositing one or more layers, e.g. of an organic material, on the substrate 10 using, for example, a mask 20. [0061] The system 500 includes a deposition chamber, such as a vacuum chamber 502, the carrier 520 according to the embodiments described herein, and a transport arrangement 510 configured for transportation of the carrier 520 in the deposition chamber. In some implementations, the system 500 includes one or more material deposition sources 580 in the deposition chamber. The carrier 520 can be configured to hold the substrate 10 during a deposition process, such as a vacuum deposition process. The system 500 can be configured for evaporation of e.g. an organic material for the manufacture of OLED devices. In another example, the system 500 can be configured for CVD or PVD, such as sputter deposition.

[0062] In some implementations, the one or more material deposition sources 580 can be evaporation sources, particularly evaporation sources for depositing one or more organic materials on a substrate to form a layer of an OLED device. The carrier 520 for supporting the substrate 10 e.g. during a layer deposition process can be transported into and through the deposition chamber, and in particular through a deposition area, along a transportation path, such as a linear transportation path. [0063] The material can be emitted from the one or more material deposition sources 580 in an emission direction towards the deposition area in which the substrate 10 to be coated is located. For instance, the one or more material deposition sources 580 may provide a line source with a plurality of openings and/or nozzles which are arranged in at least one line along the length of the one or more material deposition sources 580. The material can be ejected through the plurality of openings and/or nozzles. [0064] As indicated in FIG. 5, further chambers can be provided adjacent to the vacuum chamber 502. The vacuum chamber 502 can be separated from adjacent chambers by a valve having a valve housing 504 and a valve unit 506. After the carrier 520 with the substrate 10 thereon is inserted into the vacuum chamber 502 as indicated by the arrow, the valve unit 506 can be closed. The atmosphere in the vacuum chamber 502 can be individually controlled by generating a technical vacuum, for example with vacuum pumps connected to the vacuum chamber 502.

[0065] According to some embodiments, the carrier 520 and the substrate 10 are static or dynamic during deposition of the deposition material. According to some embodiments described herein, a dynamic deposition process can be provided, e.g., for the manufacture of OLED devices.

[0066] In some implementations, the system 500 can include one or more transportation paths extending through the vacuum chamber 502. The carrier 520 can be configured for transportation along the one or more transportation paths, for example, past the one or more material deposition sources 580. Although in FIG. 5 one transportation path is exemplarily indicated by the arrow, it is to be understood that the present disclosure is not limited thereto and that two or more transportation paths can be provided. For example, at least two transportation paths can be arranged substantially parallel to each other for transportation of respective carriers. The one or more material deposition sources 580 can be arranged between the two transportation paths.

[0067] FIG. 6 shows a schematic view of a system 600 for processing, such as vacuum processing, of a substrate 10 according to further embodiments described herein.

[0068] The system 600 includes two or more processing regions and a transport arrangement 660 according to the present disclosure configured for sequentially transporting a carrier 601 supporting a substrate 10 and optionally a mask to the two or more processing regions. For example, the transport arrangement 660 can be configured for transporting the carrier 601 along the transport direction 1 through the two or more processing regions for substrate processing. In other words, the same carrier is used for transportation of the substrate 10 through multiple processing regions. In particular, the substrate 10 is not removed from the carrier 601 between substrate processing in a processing region and substrate processing a subsequent processing region, i.e., the substrate stays on the same carrier for two or more substrate processing procedures. According to some embodiments, the carrier 601 can be configured according to the embodiments described herein. Optionally or alternatively, the transport arrangement 660 can be configured as described with respect to, for example, FIGs. 4A and B.

[0069] As exemplarily illustrated in FIG. 6, the two or more processing regions can include a first deposition region 608 and a second deposition region 612. Optionally, a transfer region 610 can be provided between the first deposition region 608 and the second deposition region 612. The plurality of regions, such as the two or more processing regions and the transfer region, can be provided in one vacuum chamber. Alternatively, the plurality of regions can be provided in different vacuum chambers connected to each other. For example, each vacuum chamber can provide one region. Specifically, a first vacuum chamber can provide the first deposition region 608, a second vacuum chamber can provide the transfer region 610, and a third vacuum chamber can provide the second deposition region 612. In some implementations, the first vacuum chamber and the third vacuum chamber can be referred to as "deposition chambers". The second vacuum chamber can be referred to as a "processing chamber". Further vacuum chambers or regions can be provided adjacent to the regions shown in the example of FIG. 6.

[0070] The vacuum chambers or regions can be separated from adjacent regions by a valve having a valve housing 604 and a valve unit 605. After the carrier 601 with the substrate 10 thereon is inserted into a region, such as the second deposition region 612, the valve unit 605 can be closed. The atmosphere in the regions can be individually controlled by generating a technical vacuum, for example, with vacuum pumps connected to the regions and/or by inserting one or more process gases, for example, in the first deposition region 608 and/or the second deposition region 612. A transportation path, such as a linear transportation path, can be provided in order to transport the carrier 601, having the substrate 10 thereon, into, through and out of the regions. The transportation path can extend at least in part through the two or more processing regions, such as the first deposition region 608 and the second deposition region 612, and optionally through the transfer region 610. [0071] The system 600 can include the transfer region 610. In some embodiments, the transfer region 610 can be omitted. The transfer region 610 can be provided by a rotation module, a transit module, or a combination thereof. FIG. 6 illustrates a combination of a rotation module and a transit module. In the rotation module, the track arrangement and the carrier(s) arranged thereon can be rotated around a rotational axis, such as a vertical rotation axis. For example, the carrier(s) can be transferred from the left side of the system 600 to the right side of the system 600, or vice versa. The transit module can include crossing tracks such that carrier(s) can be transferred through the transit module in different directions, e.g., directions perpendicular to each other. [0072] Within the deposition regions, such as the first deposition region 608 and the second deposition region 612, one or more deposition sources can be provided. For example, a first deposition source 630 can be provided in the first deposition region 608. A second deposition source 650 can be provided in the second deposition region 612. The one or more deposition sources can be evaporation sources configured for deposition of one or more organic layers on the substrate 10 to form an organic layer stack for an OLED device.

[0073] FIG. 7 shows a flow chart of a method 700 for contactless transportation of a carrier in a deposition system, such as a vacuum system, according to embodiments described herein. The method 700 can utilize the carriers, apparatuses, and systems according to the present disclosure.

[0074] The method 700 includes in block 710 a generating of at least one signal indicating at least one of a position and a speed of the carrier using an encoder, and in block 720 a controlling of at least one active magnet unit of one or more first active magnet units of the deposition system based on the at least one signal. The one or more first active magnet units can be included in the guiding structure which is configured to levitate the carrier. In some implementations, the method 700 can determine a position e.g. of ends of the carrier in the deposition system based on the positional information provided by the encoder.

[0075] According to some embodiments, the method 700 further includes measuring a gap between the one or more first active magnet units and the carrier using e.g. a distance sensor, and controlling at least one active magnet unit of the one or more first active magnet units of the deposition system based on the measured gap.

[0076] The active magnet units can be selectively controlled based on at least one of the encoder signals and the signals from the distance sensor to provide a smooth movement of the carrier. In one embodiment, a current flowing through the at least one active magnet unit of the guiding structure can be changed according to the encoder signals. For example, the current can be abruptly or continuously decreased to zero for an active magnet unit which the carrier "leaves". Further, the current can be abruptly or continuously increased from zero to a set value for an active magnet unit which the carrier "approaches" or "enters".

[0077] According to embodiments described herein, the method for contactless transportation of a carrier in a deposition system can be conducted using computer programs, software, computer software products and the interrelated controllers, which can have a CPU, a memory, a user interface, input and output devices, and bus systems being in communication with the corresponding components of the carrier, apparatus and/or system. The bus system can be wire -based or can be wireless.

[0078] According to the embodiments of the present disclosure, an encoder is used to determine a position and/or a speed of the carrier in the depositions system. In some examples, the encoder can be provided at a drive structure of a transport arrangement of the deposition system. In further examples, the encoder can be provided at the carrier so as to be transported together with the carrier. The position and/or a speed of the carrier can be used to selectively control the transport arrangement, such as active magnet units used to levitate the carrier. A smoot transportation of the carrier can be achieved.

[0079] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.