APPARATUS FOR MANUFACTURING COPPER FOIL

WIPO Patent Application WO/2023/101419

A1

The present invention relates to a copper foil manufacturing apparatus comprising: a plating tank (100) filled with an electrolyte; a negative electrode drum (300) including an inner drum body (310) which is made of copper and to which the "- electrode" is applied, and an outer drum body (320) made of titanium and provided on the outer surface of the inner drum body (310), the negative electrode drum (300) being installed at the upper part of the plating tank (100) to rotate while having the lower end thereof immersed in the electrolyte; "(" shaped electrode plates (200) which include an inner member (210) made of copper and formed in an arc shape, and an outer member (220) made of titanium and coated on the outer surface of the inner member (210) and are installed in the plating tank (100) to be at the opposite sides thereof so as to face each other; and a bus bar (240) having one end welded to the inner member (210) of the electrode plate (200) and the other end connected to the "+ electrode" of a rectifier (10) to allow current to flow to the "+ electrode", and the bus bar being coated with a titanium layer (250). The electrode plates (200) are in tight contact with each other by an explosive adhesion clad method in which the inner member (210) made of copper is inserted into the outer member (220) made of titanium in a sandwiched manner therebetween, and further includes a catalytic reaction electrode (400) provided on the curved inner surface of the electrode plate (200). The electrode plate (200) minimizes heat generation by improving an electrical conduction rate when copper foil is produced by electroplating and enables the improvement of plating speed and uniformity of plating quality by maximizing plating efficiency.