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Title:
APPARATUS AND METHOD FOR THREE-DIMENSIONAL LAMINATION
Document Type and Number:
WIPO Patent Application WO/2023/218727
Kind Code:
A1
Abstract:
Provided are an apparatus and a method for three-dimensional lamination, the apparatus being provided with: a powder-receiving member which comes into contact with a side surface of a processing target object having a molding surface, and receives a powdery material; a powder-holding member which comes into contact with an outer surface of the powder-receiving member, and is supported freely movably along a molding direction intersecting the molding surface; a transfer device which can transfer the powder-holding member along the molding direction; and an irradiation device which emits a light beam to the powdery material on the molding surface to melt and solidify the powdery material, thereby forming a molded layer.

Inventors:
TANIGAWA SHUJI (JP)
ITO RYUTA (JP)
KANNO TOSHIFUMI (JP)
KASAMI AKIKO (JP)
TACHIBANA TAKAHIRO (JP)
Application Number:
PCT/JP2023/006515
Publication Date:
November 16, 2023
Filing Date:
February 22, 2023
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B22F12/30; B22F10/28; B22F10/32; B22F12/50; B22F12/67; B22F12/70; B22F12/90; B29C64/153; B29C64/188; B29C64/255; B29C64/371; B33Y10/00; B33Y30/00
Foreign References:
US20150314403A12015-11-05
US20130136838A12013-05-30
JP2020176283A2020-10-29
JP2018145521A2018-09-20
JP2020029597A2020-02-27
KR102353234B12022-01-19
US20200384693A12020-12-10
JPH05192767A1993-08-03
JP2020122217A2020-08-13
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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