Title:
PALLADIUM CATALYST LIQUID
Document Type and Number:
WIPO Patent Application WO/2023/218728
Kind Code:
A1
Abstract:
The present invention provides a palladium catalyst liquid which is suppressed in corrosion of copper and is capable of imparting a copper surface with excellent nickel plating deposition properties, while being also capable of imparting excellent patterning properties by suppressing spreading of nickel plating on the copper surface. The present invention provides a palladium catalyst liquid which is characterized by containing (A) an organic acid, (B) a chloride and (C) a palladium salt.
Inventors:
TSUNO YUKI (JP)
HASHIZUME KEI (JP)
TANAKA KATSUYUKI (JP)
HASHIZUME KEI (JP)
TANAKA KATSUYUKI (JP)
Application Number:
PCT/JP2023/006627
Publication Date:
November 16, 2023
Filing Date:
February 24, 2023
Export Citation:
Assignee:
OKUNO CHEM IND CO (JP)
International Classes:
C23C18/30; C23C18/18
Foreign References:
| JPH11124680A | 1999-05-11 | |||
| JP2014088618A | 2014-05-15 | |||
| JPH06145994A | 1994-05-27 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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