Title:
APPARATUS AND METHOD FOR WET PROCESS ON SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/076151
Kind Code:
A1
Abstract:
An apparatus and a method for wet process on a semiconductor substrate are provided. The apparatus includes a process chamber (1005), a chuck (1002) for holding and positioning a semiconductor substrate (1001) disposed in the process chamber, a rotating driving mechanism(1004) driving the chuck to rotate, a chamber shroud (1006) disposed surrounding the process chamber, at least one vertical driving mechanism driving the chamber shroud to move up or down, a shielding cover (1007), at least one driving device (1008) driving the shielding cover to cover down or lift up, at least one dispenser module (1014) having a dispenser (1030) for spraying liquid to the surface of the semiconductor substrate. When the shielding cover covers above the process chamber, the chamber shroud is moved up to couple with the shielding cover, so as to seal the process chamber for preventing the liquid from splashing out of the process chamber.
Inventors:
WANG HUI (CN)
WANG XI (CN)
CHENG CHENG (CN)
WU JUN (CN)
WANG XI (CN)
CHENG CHENG (CN)
WU JUN (CN)
Application Number:
PCT/CN2016/103150
Publication Date:
May 03, 2018
Filing Date:
October 25, 2016
Export Citation:
Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
H01L21/67; B05C5/00
Foreign References:
| CN204216011U | 2015-03-18 | |||
| US20030192570A1 | 2003-10-16 | |||
| CN105289923A | 2016-02-03 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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