AQUEOUS CUTTING FLUID, AQUEOUS CUTTING AGENT, AND PROCESS FOR CUTTING HARD BRITTLE MATERIALS WITH THE SAME

Title:

AQUEOUS CUTTING FLUID, AQUEOUS CUTTING AGENT, AND PROCESS FOR CUTTING HARD BRITTLE MATERIALS WITH THE SAME

Document Type and Number:

WIPO Patent Application WO/1999/035220

Kind Code:

A1

Abstract:

An aqueous cutting fluid comprising a cationic water-soluble resin having an amino value of 20 to 200 mg KOH/g and at least one viscosity modifier selected from among inorganic and organic bentonites and aqueous silica sols, wherein the content of nonvolatiles in the viscosity modifier is 0.1 to 30 wt.% based on the nonvolatiles in the resin; an aqueous cutting agent prepared by incorporating abrasive grains into the fluid in an amount of 100 to 1000 wt.% based on the nonvolatiles of the fluid, which is excellent in the dispersion stability of abrasive grains and viscosity stability and effective particularly for wire saws; and a process for cutting hard brittle materials by the use of a cutting tool and the cutting agent, which permits high-accuracy processing of the hard brittle materials and excellent cleaning thereof.

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Inventors:

ITO KENJI (JP)
MAEMICHI SHUNJI (JP)
NAKANISHI HUTOSHI (JP)
ISHIDOYA MASAHIRO (JP)
TANAKA TAKASHI (JP)
NAKAMICHI TOSHIHIKO (JP)
MORI KAZUYUKI (JP)
HAYASHI SHIGEHIRO (JP)
YOKOYAMA HIDEKI (JP)

Application Number:

PCT/JP1999/000023

Publication Date:

July 15, 1999

Filing Date:

January 07, 1999

Export Citation:

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Assignee:

NOF CORP (JP)
FUJIMI INC (JP)
ITO KENJI (JP)
MAEMICHI SHUNJI (JP)
NAKANISHI HUTOSHI (JP)
ISHIDOYA MASAHIRO (JP)
TANAKA TAKASHI (JP)
NAKAMICHI TOSHIHIKO (JP)
MORI KAZUYUKI (JP)
HAYASHI SHIGEHIRO (JP)
YOKOYAMA HIDEKI (JP)

International Classes:

B28D1/02; C10M125/26; C10M125/30; C10M149/14; C10M173/02; B28D5/04; C10N20/02; C10N30/02; C10N30/04; C10N40/22; (IPC1-7): C10M173/02; C10M149/00; C10M125/26; C10M125/30

Foreign References:

JPS5989395A	1984-05-23
JPH04277598A	1992-10-02

Other References: