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Title:
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/024573
Kind Code:
A1
Abstract:
An array substrate and a manufacturing method therefor. The method comprises: forming a buffer layer (22), a light-shielding layer (23) and a whole semiconductor layer (24) on a base substrate (21), and simultaneously patterning the semiconductor layer (24) and the light-shielding layer (23); and then successively forming a first insulating layer (25), first metal layers (26, 261), a second insulating layer (27), a second metal layer (28), a flat layer (29) and a first transparent conductive layer (30) on the patterned semiconductor layer (24).

Inventors:
WANG XIAOXIAO (CN)
DU PENG (CN)
WANG CONG (CN)
Application Number:
PCT/CN2015/086821
Publication Date:
February 16, 2017
Filing Date:
August 13, 2015
Export Citation:
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Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
H01L29/786
Foreign References:
CN101345261A2009-01-14
US20080246042A12008-10-09
US20040063270A12004-04-01
CN103855225A2014-06-11
US20040135236A12004-07-15
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
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