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Patent Searching and Data


Title:
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/040706
Kind Code:
A1
Abstract:
Disclosed in the present application are an array substrate and a manufacturing method therefor. The array substrate comprises: a substrate; a first metal layer, located on one side of the substrate, the first metal layer comprising a first capacitor electrode plate; a first insulating layer, located on the side of the first metal layer facing away from the substrate, the first insulating layer at least comprising two layers, the first insulating layer comprising a first recess and a first via hole, the first recess being formed by recessing the surface of the first insulating layer facing away from the first metal layer, the first via hole passing through the first insulating layer, the orthographic projection of the first recess on the substrate at least partially overlapping with the orthographic projection of the first capacitor electrode plate on the substrate, and the orthographic projection of the first via hole on the substrate and the orthographic projection of the first capacitor electrode plate on the substrate being staggered; and a second metal layer, located on the side of the first insulating layer facing away from the first metal layer, the second metal layer comprising a second capacitor electrode plate, and at least part of the second capacitor electrode plate being located in the first recess. The present application can improve the yield of array substrates.

Inventors:
XU CHUANZHI (CN)
XIE ZHENGFANG (CN)
HU SIMING (CN)
GAO XIAOYU (CN)
Application Number:
PCT/CN2022/124521
Publication Date:
February 29, 2024
Filing Date:
October 11, 2022
Export Citation:
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Assignee:
KUNSHAN GOVISIONOX OPTOELECTRONICS CO LTD (CN)
International Classes:
H01L27/12
Foreign References:
CN110459561A2019-11-15
CN111312728A2020-06-19
CN104716091A2015-06-17
CN111276499A2020-06-12
US20210408511A12021-12-30
CN112331681A2021-02-05
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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