Title:
ARRAY SUBSTRATE, MOUNTED ELEMENT, DEVICE COMPRISING ARRAY SUBSTRATE AND METHOD FOR PRODUCING ARRAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/150776
Kind Code:
A1
Abstract:
[Solution] An array substrate according to one embodiment of the present invention comprises a mounting substrate and a plurality of elements. The plurality of elements comprise two or more first elements and one or more second elements, which are different from the first element, and are mounted on the mounting substrate so as to be arranged in an array structure.
Inventors:
ADACHI KIWAMU (JP)
OKA SHUICHI (JP)
YANAGAWA SHUSAKU (JP)
HATADA IZUHO (JP)
OKA SHUICHI (JP)
YANAGAWA SHUSAKU (JP)
HATADA IZUHO (JP)
Application Number:
PCT/JP2018/000747
Publication Date:
August 23, 2018
Filing Date:
January 15, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G09F9/00; H01L25/04; H01L25/18; H05K1/18; H05K3/34
Domestic Patent References:
| WO2005067062A1 | 2005-07-21 | |||
| WO2005067061A1 | 2005-07-21 |
Foreign References:
| JP2005123381A | 2005-05-12 | |||
| JPH09162545A | 1997-06-20 | |||
| US20060148281A1 | 2006-07-06 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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