Title:
ASHING DEVICE AND ASHING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/093216
Kind Code:
A1
Abstract:
[Problem] The objective of the invention is to provide a constitution wherein no processing unevenness arises when an object to be processed is processed for smear removal in an ashing device and an ashing method provided with: a processing chamber wherein the object to be processed is disposed; a lamp chamber having a UV-permeable window member for separating a UV lamp housed therein, which irradiates UV light onto the object to be processed, from the processing chamber; and a processing gas supply means for supplying a processing gas to a processing space formed between the object to be processed and the window member.
[Solution] The invention is characterized in that the processing gas supply means: has a control unit that is able to supply an appropriate flow volume of processing gas for carrying out the processing and is able supply a large flow volume of processing gas which exceeds said appropriate flow volume; intermittently supplies the large flow volume of processing gas; and, at a regular time interval, purges and substitutes with the processing gas an exhaust gas (carbon dioxide) generated inside the processing space.
Inventors:
HIROSE KENICHI (JP)
Application Number:
PCT/JP2014/080503
Publication Date:
June 25, 2015
Filing Date:
November 18, 2014
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
H01L21/3065; H01L21/027; H01L21/302
Foreign References:
JP2007227496A | 2007-09-06 | |||
JP2010027702A | 2010-02-04 | |||
JPH10280151A | 1998-10-20 | |||
JP2007208194A | 2007-08-16 |
Attorney, Agent or Firm:
ISOHATA MASAO (JP)
Yasuo Isohata (JP)
Yasuo Isohata (JP)
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