Title:
ASSEMBLED SLAB MANUFACTURING METHOD, ASSEMBLED SLAB, AND CLAD STEEL SHEET MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/171350
Kind Code:
A1
Abstract:
In a method for manufacturing an assembled slab as a rolled raw material for manufacturing a clad steel sheet comprising a base material, and a cladding material joined to the base material, welding is performed using high-energy beam welding on a contact portion (6) between a base raw material (1) and a cladding raw material (2) on an end surface (12) of an assembled slab (10), and, in the high-energy beam welding, an aiming position (8) of a welding beam (7) is shifted from the contact portion (6) to a high thermal conductivity material side. Consequently, in the assembled slab (10), an imbalance between a weld portion (9) and a contact surface (11) can be eliminated, and therefore it is possible to provide: an assembled slab manufacturing method with which, when joining contact portions of different types of metals using high-energy beam welding, weld metal penetration is not formed in an unbalanced manner on one material side, and supplying a filler for welding is unnecessary; an assembled slab; and a clad steel sheet manufacturing method.
More Like This:
JPS57202718 | MANUFACTURE OF LARGE-SIZED COIL |
JPS58103981 | DETECTION OF WELDED JOINT POSITION |
Inventors:
TANAKA SHOTARO (JP)
WATANABE HIROAKI (JP)
KAWA MASATOMO (JP)
WATANABE HIROAKI (JP)
KAWA MASATOMO (JP)
Application Number:
PCT/JP2023/006092
Publication Date:
September 14, 2023
Filing Date:
February 20, 2023
Export Citation:
Assignee:
NIPPON STEEL STAINLESS STEEL CORP (JP)
International Classes:
B23K15/00; B21B1/22; B23K20/04; B23K26/21; B23K26/323
Foreign References:
JP2021143387A | 2021-09-24 | |||
JPS63295078A | 1988-12-01 | |||
JPS60177980A | 1985-09-11 | |||
JP2012061474A | 2012-03-29 | |||
JP2021186861A | 2021-12-13 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Download PDF:
Previous Patent: DETECTION SYSTEM, DETECTION METHOD, AND DETECTION PROGRAM
Next Patent: CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD
Next Patent: CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD