Title:
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
Document Type and Number:
WIPO Patent Application WO/2022/230260
Kind Code:
A1
Abstract:
This assembly sheet 1 is provided with a wiring circuit board 2, a frame 3 and a reinforcement part 4. The wiring circuit board 2 comprises a support layer 11, a base insulating layer 12 and a conductor pattern 13. The frame 3 supports the wiring circuit board 2. The reinforcement part 4 is arranged on the frame 3 so as to reinforce the frame 3. The reinforcement part 4 comprises a first layer 41 that is formed of a metal, and a second layer 42 that is formed of a metal.
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| WO/2017/168952 | PRINTED WIRING BOARD |
| JP2008010032 | PACKAGING STRUCTURE OF ELECTRONIC COMPONENT AND OPTICAL HEAD DEVICE |
Inventors:
TSUNEKAWA MAKOTO (JP)
Application Number:
PCT/JP2022/002939
Publication Date:
November 03, 2022
Filing Date:
January 26, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/02; H05K3/00
Foreign References:
| JP2019153687A | 2019-09-12 | |||
| JPH06216493A | 1994-08-05 | |||
| JP2015142115A | 2015-08-03 | |||
| JP2011100776A | 2011-05-19 | |||
| JP2006202849A | 2006-08-03 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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