Title:
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
Document Type and Number:
WIPO Patent Application WO/2022/230261
Kind Code:
A1
Abstract:
This assembly sheet 1 is provided with a plurality of circuit boards 2, a frame 2, and a reinforcing part 4. The circuit board 2 has a support layer 11, a base insulating layer 12 arranged on one surface S1 of the support layer 11 in the thickness direction, and a conductor pattern 13 arranged on one surface S11 of the base insulating layer 12 in the thickness direction. The frame 3 supports the circuit board 2. The reinforcing part 4 reinforces the frame 3. The reinforcing part 4 is arranged on another surface S22 of the frame 3 in the thickness direction.
Inventors:
TSUNEKAWA MAKOTO (JP)
Application Number:
PCT/JP2022/002940
Publication Date:
November 03, 2022
Filing Date:
January 26, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/02; H05K3/00
Foreign References:
| JP2019153687A | 2019-09-12 | |||
| JPH06216493A | 1994-08-05 | |||
| JP2015142115A | 2015-08-03 | |||
| JP2019212659A | 2019-12-12 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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