Title:
AUDIO TRANSMISSION CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2016/000611
Kind Code:
A1
Abstract:
Disclosed is an audio transmission circuit. The audio transmission circuit includes an audio plug, at least one acoustic component and n subunits. Each subunit includes a first connection end and a second connection end. The first connection end is connected with the second connection end in each subunit. The second connection end of a previous subunit is selectively connected with the first connection end of a next subunit. A complete headset function is achieved when the signal conduction between the audio plug and the acoustic component is implemented via the subunits. At least one subunit includes a function module for accomplishing a preset function. Selection and application of a variety of functions is realized, thus improving the integration level of an apparatus.
Inventors:
CHEN FENG (CN)
HU JING (CN)
HU JING (CN)
Application Number:
PCT/CN2015/083015
Publication Date:
January 07, 2016
Filing Date:
July 01, 2015
Export Citation:
Assignee:
WANG WEIBING (CN)
International Classes:
H04R1/10
Domestic Patent References:
WO2013103196A1 | 2013-07-11 |
Foreign References:
CN202261757U | 2012-05-30 | |||
CN203661260U | 2014-06-18 | |||
CN2742702Y | 2005-11-23 | |||
CN204014026U | 2014-12-10 | |||
CN203813935U | 2014-09-03 | |||
CN102395075A | 2012-03-28 | |||
CN202143198U | 2012-02-08 | |||
EP2384020A1 | 2011-11-02 |
Attorney, Agent or Firm:
SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
上海思微知识产权代理事务所(普通合伙) (CN)
上海思微知识产权代理事务所(普通合伙) (CN)
Download PDF:
Previous Patent: TIDAL CURRENT ENERGY ELECTRIC GENERATING APPARATUS
Next Patent: GLASS ENCAPSULATION STRUCTURE AND INJECTION MOLDING DEVICE
Next Patent: GLASS ENCAPSULATION STRUCTURE AND INJECTION MOLDING DEVICE