Title:
AUTOMATED POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/161581
Kind Code:
A1
Abstract:
Provided is an automated polishing system capable of achieving a constant polished film thickness throughout a polishing process. An automated polishing system comprising: a polishing tool which includes a polishing member for polishing a region to be polished, and an electric motor for driving the polishing member; a polishing robot which moves the polishing tool with respect to the region to be polished; and a polishing controller which controls the polishing tool and the polishing robot. The automated polishing system comprises: a current measurement device which measures a consumed current value of the electric motor; and a pushing force adjustment mechanism which adjusts a force for pushing the polishing member against the region to be polished. The polishing controller is configured to adjust the pushing force of the polishing member via the pushing force adjustment mechanism on the basis of the consumed current value measured by the current measurement device such that the consumed current value is substantially constant during the polishing process.
Inventors:
NAKAYAMA GENJI (JP)
HIGASHI YOSHIO (JP)
HAYASHI YOSHIKAZU (JP)
SUZUKI HIROYUKI (JP)
YAMASHITA TOMOO (JP)
HIGASHI YOSHIO (JP)
HAYASHI YOSHIKAZU (JP)
SUZUKI HIROYUKI (JP)
YAMASHITA TOMOO (JP)
Application Number:
PCT/JP2020/037810
Publication Date:
August 19, 2021
Filing Date:
October 06, 2020
Export Citation:
Assignee:
TAIKISHA KK (JP)
International Classes:
B24B27/00; B24B49/14; B24B49/16
Foreign References:
| JP2009226562A | 2009-10-08 | |||
| JP2019005811A | 2019-01-17 | |||
| JPH04300162A | 1992-10-23 | |||
| JP2019162712A | 2019-09-26 | |||
| JP2009131950A | 2009-06-18 | |||
| JPH0857764A | 1996-03-05 | |||
| JP2000033567A | 2000-02-02 | |||
| JP2019177427A | 2019-10-17 | |||
| JP2019206027A | 2019-12-05 |
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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