Title:
AUTOMATIC SPLICING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/157109
Kind Code:
A1
Abstract:
Provided is an automatic splicing device in which a control device (100) is configured to calculate, on the basis of first and second component presence signals, first and second cutting points (Q1, Q2) for each of first and second tapes (T1, T2) from a predetermined pitch (Pc) for first and second cavities (Ct1, Ct2), and from first and second distances (D1, D2) between first and section detection positions (Ld1, Ld2) and first and second cutting positions (Lc1, Lc2). As a result, it is possible to determine a cutting point even for tape having a pitch that differs between cavities, thus making it possible to reliably carry out splicing of said tape.
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Inventors:
CHI XIAO DONG (JP)
Application Number:
PCT/JP2012/060515
Publication Date:
October 24, 2013
Filing Date:
April 18, 2012
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
CHI XIAO DONG (JP)
CHI XIAO DONG (JP)
International Classes:
H05K13/02; B65H19/18
Foreign References:
| JP2002207286A | 2002-07-26 | |||
| JP2010120344A | 2010-06-03 | |||
| JPH0679788A | 1994-03-22 | |||
| JPH0964109A | 1997-03-07 | |||
| JPH08107268A | 1996-04-23 | |||
| JP2006149806A | 2006-06-15 | |||
| JPH04243757A | 1992-08-31 |
Other References:
See also references of EP 2840877A4
Attorney, Agent or Firm:
KOBAYASHI OSAMU (JP)
Kobayashi 脩 (JP)
Kobayashi 脩 (JP)
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