Title:
AUTOMATIC WAFER PROCESSING METHOD AND AUTOMATIC WAFER PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/179011
Kind Code:
A1
Abstract:
The present application relates to the technical field of semiconductor manufacturing, and in particular to an automatic wafer processing method and an automatic wafer processing apparatus. The automatic wafer processing method comprises the following steps: providing several wafers, wherein the wafers run on a primary path, and the primary path is a path for forming a semiconductor structure on surfaces of the wafers; determining whether defect review is required to be performed on the wafers, and if so, automatically switching the path on which the wafers run to a secondary path; on the secondary path, performing defect review on the wafers; and determining whether defect review has been completed on the wafers, and if so, automatically switching the path on which the wafers run to the primary path. By means of the present application, automated defect review can be performed on wafers which are under different SWR conditions, thereby increasing the level of automation of a machine table.
Inventors:
YANG PENG (CN)
GAO BIAO (CN)
WU LIWEI (CN)
WANG WENYI (CN)
GAO BIAO (CN)
WU LIWEI (CN)
WANG WENYI (CN)
Application Number:
PCT/CN2021/101960
Publication Date:
September 01, 2022
Filing Date:
June 24, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L21/66; G06T7/00; H01L21/67
Foreign References:
| CN109427609A | 2019-03-05 | |||
| CN111554601A | 2020-08-18 | |||
| CN104699025A | 2015-06-10 | |||
| US20090304261A1 | 2009-12-10 |
Attorney, Agent or Firm:
SHANGHAI WINSUN INTELLECTUAL PROPERTY AGENCY (CN)
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