Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BASE MATERIAL FILM, AND WORKPIECE MACHINING SHEET
Document Type and Number:
WIPO Patent Application WO/2021/200619
Kind Code:
A1
Abstract:
A base material film composed of a material including a polyester resin, wherein in a curve obtained by plotting the measurement results of a tensile test, which has been performed on the base material film in an environment of 23°C at a tensile speed of 406 mm/min, in a coordinate plane with a tensile elongation (unit: %) plotted against the abscissa and a tensile stress (unit: MPa) plotted against the ordinate, there is no maximum point, or there is at least one maximum point and at least one minimum point, and the absolute value of the difference between the value of the tensile stress in a point where the tensile elongation value is at minimum among the aforementioned maximum points, and the value of the tensile stress in a point where the tensile elongation value is at minimum among the aforementioned minimum points is 2.0 MPa or less. Such a base material film has excellent flexibility that enables good expansion, and with such a base material film, a workpiece machining sheet capable of good expansion can be obtained.

Inventors:
SASAKI HARUKA (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2021/012780
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/36; C08G63/199; H01L21/301
Foreign References:
JP2015095514A2015-05-18
JP2011219563A2011-11-04
JP2016069600A2016-05-09
JP2002012749A2002-01-15
JP2007005436A2007-01-11
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF: