Title:
BASE MATERIAL FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/077815
Kind Code:
A1
Abstract:
A base material for a printed wiring board according to one embodiment of the present invention is provided with: an insulating base film; a sintered body layer which is stacked on at least one surface of the base film, and which is formed from a plurality of sintered metal particles; and an electroless plating layer which is stacked on the surface of the sintered body layer on the opposite side to the base film. The area ratio of a sintered body of the metal particles in a cross section of the sintered body layer is in the range of 50-90% inclusive.
Inventors:
MIYATA KAZUHIRO (JP)
SUGIURA MOTOHIKO (JP)
YAMAMOTO MASAMICHI (JP)
SUGIURA MOTOHIKO (JP)
YAMAMOTO MASAMICHI (JP)
Application Number:
PCT/JP2018/025835
Publication Date:
April 25, 2019
Filing Date:
July 09, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K1/09; C22C1/04; C23C28/02; H05K3/18; H05K3/38; B22F1/0545; B22F1/10
Domestic Patent References:
| WO2016117575A1 | 2016-07-28 | |||
| WO2014045972A1 | 2014-03-27 | |||
| WO2015147219A1 | 2015-10-01 |
Foreign References:
| JP2006024808A | 2006-01-26 | |||
| JP2011082145A | 2011-04-21 | |||
| JP2010102988A | 2010-05-06 |
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
Download PDF:
Previous Patent: CHARGE DETECTION SENSOR AND POTENTIAL MEASURING SYSTEM
Next Patent: BASE MATERIAL FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
Next Patent: BASE MATERIAL FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD