Title:
BENDING SYSTEM AND MOLD DISPOSITION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/038065
Kind Code:
A1
Abstract:
A control device (100) moves lower mold replacement units (50L, 50R) that are holding lower molds (14) in the right-left direction and positions the lower molds (14) at a target location in a mold holder (30). When moving the lower mold replacement units (50L, 50R) toward the target location, the control device (100) brings the lower mold replacement units (50L, 50R) to a temporary halt at a location different from the target location, then moves the lower mold replacement units (50L, 50R) again, and brings the lower mold replacement units (50L, 50R) to a stop at the target location.
Inventors:
YAMAGUCHI YOHEI (JP)
MOCHIDA KAZUHO (JP)
ONAGI YOUSUKE (JP)
MOCHIDA KAZUHO (JP)
ONAGI YOUSUKE (JP)
Application Number:
PCT/JP2022/033605
Publication Date:
March 16, 2023
Filing Date:
September 07, 2022
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B21D5/02; B21D37/04
Foreign References:
| JP2020189333A | 2020-11-26 | |||
| JP2019122972A | 2019-07-25 | |||
| JP2020199551A | 2020-12-17 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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