BENDING SYSTEM, AND SPLIT MOLD ARRANGEMENT METHOD

WIPO Patent Application WO/2022/224943

A1

In the present invention, a collecting operation includes: a restraining operation in which a left-side lower mold retaining member (64L) is advanced so that a reference lower mold (14a) is restrained with the left-side lower mold retaining member (64L); an inserting operation in which a right-side lower mold retaining member (64R) is advanced so that the right-side lower mold retaining member (64R) is inserted into a through hole of a target lower mold (14h); and an execution operation in which the left and right lower mold retaining members (64L, 64R) are moved along the left-right direction so as to approach each other, thereby collecting the lower molds (14a-14h), from the reference lower mold (14a) to the target lower mold (14h). If it is determined that the insertion operation has failed, a control device (100) performs a retry operation in which the left-side lower mold retaining member (64L) is retracted to release the restraining operation, and then the right-side lower mold retaining member (64R) is advanced again and inserted into the through hole (141) of the target lower mold (14h).

ONAGI YOUSUKE (JP)
MOCHIDA KAZUHO (JP)
WATANABE KATSUMI (JP)

PCT/JP2022/018100

October 27, 2022

April 19, 2022

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AMADA CO LTD (JP)

B21D5/02; B21D37/04; B30B15/02

JP2020199551A	2020-12-17
JP2020189333A	2020-11-26
JP2020182958A	2020-11-12
JP5947861B2	2016-07-06
JP5947861B2	2016-07-06
JP2021072018A	2021-05-06
JP2022065127A	2022-04-26

MIYOSHI Hidekazu et al. (JP)

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