Title:
Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2012/002173
Kind Code:
A1
Abstract:
A high-temperature solder alloy comprising a Bi-Sn-based solder alloy containing 90 mass% or more of Bi, wherein the Bi-Sn-based solder alloy additionally contains 1 to 5 mass% of Sn and 0.5 to 5 mass% of at least one element selected from Sb and/or Ag, and more preferably additionally contains 0.0004 to 0.01 mass% of P.
Inventors:
UESHIMA MINORU (JP)
INAGAWA YOSHIMI (JP)
TOYODA MINORU (JP)
INAGAWA YOSHIMI (JP)
TOYODA MINORU (JP)
Application Number:
PCT/JP2011/063894
Publication Date:
January 05, 2012
Filing Date:
June 17, 2011
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
UESHIMA MINORU (JP)
INAGAWA YOSHIMI (JP)
TOYODA MINORU (JP)
UESHIMA MINORU (JP)
INAGAWA YOSHIMI (JP)
TOYODA MINORU (JP)
International Classes:
B23K35/26; B23K1/00; C22C12/00; H05K3/34; B23K101/40
Domestic Patent References:
| WO2007018288A1 | 2007-02-15 |
Foreign References:
| JP2005288529A | 2005-10-20 | |||
| JP2004533327A | 2004-11-04 | |||
| JP2007181880A | 2007-07-19 | |||
| JP2004114093A | 2004-04-15 |
Other References:
See also references of EP 2589459A4
Attorney, Agent or Firm:
HIROSE SHOICHI (JP)
Hirose Shoichi (JP)
Hirose Shoichi (JP)
Download PDF:
Claims:
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