Title:
LEAD-FREE GLASS FOR SEALING SEMICONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2012/002174
Kind Code:
A1
Abstract:
Provided is a lead-free glass for sealing a semiconductor, which facilitates automation of external inspection and has excellent clarity and semiconductor element sealing performance. The lead-free glass for sealing a semiconductor has a viscosity of 106 dPa∙s at a temperature of 670°C or lower, and has a glass composition comprising 0.01-6 mass% of CeO2 content and 0.1 mass% or less of Sb2O3 content.
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Inventors:
HASHIMOTO KOICHI (JP)
Application Number:
PCT/JP2011/063917
Publication Date:
January 05, 2012
Filing Date:
June 17, 2011
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
HASHIMOTO KOICHI (JP)
HASHIMOTO KOICHI (JP)
International Classes:
C03C3/068; C03C3/095; H01L23/29; H01L23/31; H01L33/52
Foreign References:
| JP2002037641A | 2002-02-06 | |||
| JP2010006627A | 2010-01-14 | |||
| JP2009013002A | 2009-01-22 |
Attorney, Agent or Firm:
NAITO TERUO (JP)
Teruo Naito (JP)
Teruo Naito (JP)
Download PDF:
Claims:
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