Title:
BINDING PROTECTIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2023/234125
Kind Code:
A1
Abstract:
The present invention provides a binding protective tape which has an excellent balance of flexibility and protective performance, and a base material of which exhibits excellent film formation properties. According to the present invention, provided is a binding protective tape comprising a base material and an adhesive layer that is formed on one surface of the base material, wherein: the base material is constituted by a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a polyorganosiloxane; and the content of the polyorganosiloxane in the resin composition is 1-10 parts by mass per 100 parts by mass of the polyvinyl chloride resin.
Inventors:
TATE YOSUKE (JP)
SUZUKI RIO (JP)
HASUMI MIZUKI (JP)
SUZUKI RIO (JP)
HASUMI MIZUKI (JP)
Application Number:
PCT/JP2023/019199
Publication Date:
December 07, 2023
Filing Date:
May 23, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J7/24; C08K3/013; C08K5/00; C08L27/06; C08L83/04
Domestic Patent References:
WO2021029403A1 | 2021-02-18 |
Foreign References:
JP3888431B2 | 2007-03-07 | |||
CN111748162A | 2020-10-09 | |||
JPH08291243A | 1996-11-05 | |||
US6541558B1 | 2003-04-01 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
Download PDF:
Previous Patent: BINDING PROTECTIVE TAPE
Next Patent: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Next Patent: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS