Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/234126
Kind Code:
A1
Abstract:
This substrate processing method comprises: a liquid processing step; a conveyance step; and a supercritical step. In the liquid processing step, liquid processing of a substrate is performed in a liquid processing unit, and the surface of the substrate is wetted. In the conveyance step, the substrate, the surface of which has been wetted, is conveyed from the liquid processing unit to a supercritical processing unit. In the supercritical step, the substrate, the surface of which has been wetted, is treated with a supercritical liquid in the supercritical processing unit. If it has been determined that conveyance of the substrate to the supercritical processing unit is not possible, the supply of processing liquid to the substrate is continued in the liquid processing step.
Inventors:
EMURA TOMOFUMI (JP)
YOSHIMURA AKIHITO (JP)
GOTO SHUHEI (JP)
IHARA TORU (JP)
FUKUI SHOGO (JP)
YOSHIMURA AKIHITO (JP)
GOTO SHUHEI (JP)
IHARA TORU (JP)
FUKUI SHOGO (JP)
Application Number:
PCT/JP2023/019210
Publication Date:
December 07, 2023
Filing Date:
May 23, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2019087687A | 2019-06-06 | |||
| JP2019121781A | 2019-07-22 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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