Title:
BLOOD VESSEL POSITION DETECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/049194
Kind Code:
A1
Abstract:
A blood vessel position detection device capable of visually detecting the position of a blood vessel by bringing it into contact with the skin of a test subject. The blood vessel position detection device comprises a flexible flat plate-shaped substrate having a hole part and a plurality of light sources disposed around the hole part on one side surface of the substrate. When a blood vessel is observed through the space of the hole part, the blood vessel is shaded against scattered light from the inside of the skin by a light in a visible region, and the position of the blood vessel can be confirmed with the naked eye. Also, since the blood vessel position detection device may comprise a fixing means, with the substrate fixed to the test subject at a specified position, the position of the blood vessel can be confirmed with the naked eye before an injection is performed.
More Like This:
Inventors:
MORIMOTO MASAFUMI (JP)
HAYASAKI YOSHIO (JP)
KATAYAMA KATSUHIRO (JP)
KOJIMA YUKIO (JP)
HAYASAKI YOSHIO (JP)
KATAYAMA KATSUHIRO (JP)
KOJIMA YUKIO (JP)
Application Number:
PCT/JP2005/020182
Publication Date:
May 11, 2006
Filing Date:
November 02, 2005
Export Citation:
Assignee:
NITTO BOSEKI CO LTD (JP)
UNIV TOKUSHIMA (JP)
MORIMOTO MASAFUMI (JP)
HAYASAKI YOSHIO (JP)
KATAYAMA KATSUHIRO (JP)
KOJIMA YUKIO (JP)
UNIV TOKUSHIMA (JP)
MORIMOTO MASAFUMI (JP)
HAYASAKI YOSHIO (JP)
KATAYAMA KATSUHIRO (JP)
KOJIMA YUKIO (JP)
International Classes:
A61B5/107; A61M5/00
Foreign References:
JP2004237051A | 2004-08-26 | |||
JP2003052699A | 2003-02-25 | |||
US20040015158A1 | 2004-01-22 | |||
JPH07255847A | 1995-10-09 |
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo 04, JP)
Download PDF:
Previous Patent: DESTATICIZING MOLDED ARTICLE
Next Patent: METHOD FOR PRODUCING CeO2 FINE PARTICLES AND POLISHING SLURRY CONTAINING SUCH FINE PARTICLES
Next Patent: METHOD FOR PRODUCING CeO2 FINE PARTICLES AND POLISHING SLURRY CONTAINING SUCH FINE PARTICLES