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Patent Searching and Data


Title:
DESTATICIZING MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2006/049193
Kind Code:
A1
Abstract:
[PROBLEMS] In order to ease a sever pain by electrostatic charge in winter or the like, when a destaticizing molded article is to be bonded to a member to be bonded such as a door knob, conductive tape or conductive adhesive is necessary for pasting the member to be bonded and the destaticizing molded article together to free static electricity electrifying the destaticizing molded article; this degrades the design and the economy of the destaticizing molded article. [MEANS FOR SOLVEING PROBLEMS] A destaticizing molded article provided on the rear surface thereof with an adhesive layer, wherein the surface resistivity of the article is 108-1010&ohm /&square , the volume resistivity of the adhesive layer is at least 1×107&ohm ·cm, and the thickness of the adhesive layer is up to 5mm.

Inventors:
KIUCHI MASATO (JP)
MATSUTANI TAKAOMI (JP)
HOSHIKAWA KAZUTSUGU (JP)
Application Number:
PCT/JP2005/020178
Publication Date:
May 11, 2006
Filing Date:
November 02, 2005
Export Citation:
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Assignee:
AND TECHNOLOGY NAT INST OF ADV (JP)
NEO STAR CO LTD (JP)
KIUCHI MASATO (JP)
MATSUTANI TAKAOMI (JP)
HOSHIKAWA KAZUTSUGU (JP)
International Classes:
H05F1/00; B32B7/02; C08J7/04; E05B1/00; H05F3/02; C08L101/00
Domestic Patent References:
WO2000040642A12000-07-13
Foreign References:
JPH11297490A1999-10-29
JPH0579900U1993-10-29
JP2004250942A2004-09-09
JPH0619200Y21994-05-18
JPS61290698A1986-12-20
Attorney, Agent or Firm:
Miyazaki, Tadaaki (Facade Esaka Building 9F 23-43, Esaka-cho 1-chom, Suita-shi Osaka, JP)
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