Title:
BOARD MODULE, AND ELECTRICAL CONNECTION BOX
Document Type and Number:
WIPO Patent Application WO/2023/282139
Kind Code:
A1
Abstract:
The objective of the present invention is to improve heat dissipation characteristics while reducing the distance between boards when electrically connecting circuits on the boards together. This board module comprises a first board including a first circuit, and a first connector provided on the first board, wherein: the first connector is connected to a second connector; a through hole is formed in the first board; the first connector includes a connector housing disposed in the through hole, and a first terminal; and the first terminal includes a first board-side end portion connected to the first circuit, a first terminal portion held in the connector housing, and a heat dissipating portion which is provided between the first board-side end portion and the first terminal portion, and which is exposed from the connector housing when seen from the opposite side to the second connector.
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Inventors:
TAKAMIZAWA SHUN (JP)
Application Number:
PCT/JP2022/025942
Publication Date:
January 12, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R12/71; H02G3/16; H05K7/20
Foreign References:
| JPH11144823A | 1999-05-28 | |||
| JP2017010807A | 2017-01-12 | |||
| JPH0722476U | 1995-04-21 | |||
| JP2015005401A | 2015-01-08 | |||
| JP2000251989A | 2000-09-14 | |||
| JP2018206623A | 2018-12-27 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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