Title:
BONDED ASSEMBLIES
Document Type and Number:
WIPO Patent Application WO2005118291
Kind Code:
A3
Abstract:
A process for manufacturing bonded assemblies (100) comprises providing a first layer (106) formed of a substrate material that is one of an electrical conductor, a semiconductor and an electrical insulator. A second layer (102) of an electrically insulation material is formed on the top surface of the first layer (106), the second layer (102) having a top surface (103). A third layer (104) formed of a semiconductor material is disposed near the top surface (103) of the second layer (102). The third layer (104) is pressed against the top surface (103) of the second layer (102) with sufficient force to produce a predetermined contact pressure along a junction region between the second and third layers (102, 104). The junction regions heated to produce a predetermined initial temperature in the junction region. The predetermined contact pressure and an elevated temperature are maintained in the junction region until a diffusion bond forms between the second and third layers (103, 104).
Inventors:
STARK DAVID H (US)
Application Number:
PCT/US2005/013237
Publication Date:
December 28, 2006
Filing Date:
April 19, 2005
Export Citation:
Assignee:
STARK DAVID H (US)
International Classes:
B29C65/02; B32B37/00; B32B37/04; B32B37/28; H01L21/18; H01L21/762; H05K13/04
Foreign References:
| US4016644A | 1977-04-12 | |||
| US6897125B2 | 2005-05-24 | |||
| US5846638A | 1998-12-08 | |||
| US4261086A | 1981-04-14 |
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