HEAT SHRINK LAMINATE FILM, MOLDING UTILIZING THE FILM, HEAT SHRINK LABEL AND CONTAINER

Title:

HEAT SHRINK LAMINATE FILM, MOLDING UTILIZING THE FILM, HEAT SHRINK LABEL AND CONTAINER

Document Type and Number:

WIPO Patent Application WO/2005/118288

Kind Code:

A1

Abstract:

A heat shrink laminate film that excels in film nerve (rigidity at ordinary temperature), shrink finishing quality, transparency at regenerative addition and natural shrinkage and suppresses film delamination to thereby find suitable application in shrink wrapping, shrink bundling wrapping, shrink label, etc.; and a plastic container fitted with a heat shrink label constituted of the laminate film. There is provided a laminate film comprising a surface layer (S layer) composed mainly of a polyester resin, an intermediate layer (M layer) composed mainly of a styrene resin and an adhesive layer (AD layer) composed mainly of an adhesive resin, which laminate film exhibits a heat shrinkage ratio, measured upon dipping in 80&ring C water for 10 sec, of ≥30% in at least one direction, or exhibits a modulus of elongation of ≥ 1200 MPa in the direction perpendicular to main shrink direction.

Inventors:

YAMADA TAKEYOSHI (JP)
HIRUMA TAKASHI (JP)
TANAKA YUKIHIRO (JP)
TAKAGI JYUN (JP)
MIYAZAKI HIDEYASU (JP)

Application Number:

PCT/JP2005/010083

Publication Date:

December 15, 2005

Filing Date:

June 01, 2005

Export Citation:

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Assignee:

MITSUBISHI PLASTICS INC (JP)
YAMADA TAKEYOSHI (JP)
HIRUMA TAKASHI (JP)
TANAKA YUKIHIRO (JP)
TAKAGI JYUN (JP)
MIYAZAKI HIDEYASU (JP)

International Classes:

B29C61/00; B29C61/06; B32B27/30; B32B27/36; B65D65/40; G09F3/04; (IPC1-7): B32B27/30; B29C61/06; B32B27/36; B65D65/40; G09F3/04

Domestic Patent References:

WO1999029490A1

1999-06-17

Foreign References:

JPH04364948A	1992-12-17
JPH055659B2	1993-01-22
JP3286594B2	2002-05-27
JPS6141543A	1986-02-27
JP2002351332A	2002-12-06
JPH07137212A	1995-05-30
US20020012803A1	2002-01-31

Other References: