Title:
BONDED-SUBSTRATE FABRICATION METHOD, BONDED SUBSTRATE, SUBSTRATE BONDING METHOD, BONDED-SUBSTRATE FABRICATION DEVICE, AND SUBSTRATE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2012/105473
Kind Code:
A1
Abstract:
[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
Inventors:
SUGA TADATOMO (JP)
YAMAUCHI AKIRA (JP)
KONDOU RYUICHI (JP)
MATSUMOTO YOSHIIE (JP)
YAMAUCHI AKIRA (JP)
KONDOU RYUICHI (JP)
MATSUMOTO YOSHIIE (JP)
Application Number:
PCT/JP2012/051935
Publication Date:
August 09, 2012
Filing Date:
January 30, 2012
Export Citation:
Assignee:
SUGA TADATOMO (JP)
BONDTECH CO LTD (JP)
TAIYO YUDEN KK (JP)
LAN TECHNICAL SERVICE CO LTD (JP)
YAMAUCHI AKIRA (JP)
KONDOU RYUICHI (JP)
MATSUMOTO YOSHIIE (JP)
BONDTECH CO LTD (JP)
TAIYO YUDEN KK (JP)
LAN TECHNICAL SERVICE CO LTD (JP)
YAMAUCHI AKIRA (JP)
KONDOU RYUICHI (JP)
MATSUMOTO YOSHIIE (JP)
International Classes:
H01L21/02; B23K20/00; B23K20/14; B23K20/16; B23K20/24
Foreign References:
| JP2009010263A | 2009-01-15 | |||
| JP2008062267A | 2008-03-21 | |||
| JP2004337927A | 2004-12-02 |
Other References:
See also references of EP 2672509A4
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
Yoshitaka Sonoda (JP)
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Claims: