Title:
BONDING APPARATUS AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/055730
Kind Code:
A9
Abstract:
A bonding apparatus has a first holding section which holds a first member by placing the first member on the upper surface, and a second holding section which holds a second member by sucking the second member onto the lower surface. The second holding section is configured such that the center section warps when predetermined pressure is applied. The second holding section is provided with a sucking mechanism which sucks the atmosphere in a bonding space between the first holding section and the second holding section. On the outer circumferential lower surface of the second holding section, a protruding section which protrudes downward along the outer circumferential lower surface is formed. The lower surface of the protruding section is provided with a sealing member which maintains airtightness of the bonding space and has elasticity. The side surface of the first holding section is provided with a height adjusting mechanism which abuts on the protruding section and can adjust the distance in the perpendicular direction between the first member and the second member in the bonding space.
More Like This:
Inventors:
SUGIYAMA MASAHIKO (JP)
Application Number:
PCT/JP2009/065889
Publication Date:
August 12, 2010
Filing Date:
September 11, 2009
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
SUGIYAMA MASAHIKO (JP)
SUGIYAMA MASAHIKO (JP)
International Classes:
H01L21/02; H01L21/68
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
Tetsuo Kanamoto (JP)
Download PDF: