Title:
BONDING METHOD、BONDING DEVICE, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/029790
Kind Code:
A1
Abstract:
Disclosed is a bonding device for forming uniform loops at high speed. In a bonding device (1), a capillary (5) is lowered to a bonding position for bonding an initial ball (10) to a pad (104) of an overhang die (100), and the position of the capillary (5) in the Z-axis direction and the load detected by a load sensor (7) are detected and stored at predetermined times. A load change-point is then detected by referring to stored values of the load acting on the capillary (5) and the position of the capillary (5), and the bonding position is subtracted from the load-change position of the capillary (5) at the load change-point to calculate the movement amount (Z) of the capillary (5) from the load-change position to the bonding position. After the capillary (5) has been lifted by the calculated movement amount (Z), a wire loop is formed between the pad (104) and a lead (105).
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Inventors:
AOYAGI NOBUYUKI (JP)
YOSHINO HIROAKI (JP)
YOSHINO HIROAKI (JP)
Application Number:
PCT/JP2009/058393
Publication Date:
March 18, 2010
Filing Date:
April 28, 2009
Export Citation:
Assignee:
SHINKAWA KK (JP)
AOYAGI NOBUYUKI (JP)
YOSHINO HIROAKI (JP)
AOYAGI NOBUYUKI (JP)
YOSHINO HIROAKI (JP)
International Classes:
H01L21/60
Foreign References:
| JP2005167054A | 2005-06-23 | |||
| JP2006303168A | 2006-11-02 | |||
| JP2008021839A | 2008-01-31 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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