Title:
BONDING DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/187292
Kind Code:
A1
Abstract:
A flip-chip bonding device (500) for layer-bonding a second-layer semiconductor chip (30), on which a second through electrode is provided, to a first-layer semiconductor chip (20), on which a first through electrode is provided, at a position corresponding to the first through electrode, and equipped with a control unit (50), and a double-view camera (16) for capturing images of the semiconductor chips (20, 30), wherein the control unit (50) is provided with a relative-position detection program (53) for detecting the relative positions of the semiconductor chips (20, 30) in the layer-bonded layers, on the basis of an image of the first through electrode on the surface of the first-layer semiconductor chip (20) captured by the double-view camera (16) prior to the layer-bonding, and an image of the second through electrode on the surface of the second-layer semiconductor chip (30) captured by the double-view camera (16) after the layer-bonding. Consequently, through electrodes can be accurately connected by using a simple method.
Inventors:
TANI DAISUKE (JP)
TAKAHASHI KOICHI (JP)
TAKAHASHI KOICHI (JP)
Application Number:
PCT/JP2013/065575
Publication Date:
December 19, 2013
Filing Date:
June 05, 2013
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60
Domestic Patent References:
| WO2011087003A1 | 2011-07-21 | |||
| WO2006062091A1 | 2006-06-15 |
Foreign References:
| JP2003197682A | 2003-07-11 | |||
| JP2004146776A | 2004-05-20 | |||
| JP2006041006A | 2006-02-09 |
Attorney, Agent or Firm:
YKI Patent Attorneys (JP)
Patent business corporation YKI international patent firm (JP)
Patent business corporation YKI international patent firm (JP)
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