Title:
BONDING DEVICE AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/013300
Kind Code:
A1
Abstract:
This bonding device 1 is provided with: a bonding mechanism 20 which has a bonding surface 21S that holds a semiconductor die 102 in a detachable manner, with a film 200 being interposed therebetween, and a heater 22 that applies heat to the bonding surface 21S; a film conveyance mechanism 30 which supplies the film 200 to the bonding surface 21S; a remover bar 43 which is able to enter between the film 200 and the bonding surface 21S; and a drive unit 50 which drives the remover bar 43.
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Inventors:
SEYAMA KOHEI (JP)
NOGUCHI YUICHIRO (JP)
NOGUCHI YUICHIRO (JP)
Application Number:
PCT/JP2018/026389
Publication Date:
January 17, 2019
Filing Date:
July 12, 2018
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60
Foreign References:
| US20140069989A1 | 2014-03-13 | |||
| JP2012044071A | 2012-03-01 | |||
| JP2012028594A | 2012-02-09 | |||
| JP2003007771A | 2003-01-10 | |||
| JP2010192615A | 2010-09-02 | |||
| JPH0661307A | 1994-03-04 | |||
| JP2009016523A | 2009-01-22 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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