Title:
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/075566
Kind Code:
A1
Abstract:
A bonding method for bonding substrates together, the method comprising: (a) a step for moving a first holding part and a second holding part relative to each other by a movement mechanism so as to cause a first substrate being held on the undersurface of the first holding part and a second substrate being held on the top surface of the second holding part to be disposed to face each other; (b) a step for bringing the central part of the first substrate and the central part of the second substrate into abutment with each other by means of an abutment member; (c) a step for bonding the first substrate and the second substrate from the central part of the first substrate toward the outer peripheral part thereof in a state in which the central part of the first substrate and the central part of the second substrate are in abutment with each other; and (d) a step for measuring, at least in said step (c), a real position of the first holding part and/or the second holding part moved in the step (a), and inspecting the state of the bonding process on the basis of the real position.
Inventors:
NAKAMITSU TAKASHI (JP)
FUKUSHIMA HIDEYUKI (JP)
WAKAMOTO YUKIHIRO (JP)
MATUO YUHEI (JP)
SAIKI KEIICHI (JP)
KOHAMA NORIFUMI (JP)
FUKUSHIMA HIDEYUKI (JP)
WAKAMOTO YUKIHIRO (JP)
MATUO YUHEI (JP)
SAIKI KEIICHI (JP)
KOHAMA NORIFUMI (JP)
Application Number:
PCT/JP2023/034693
Publication Date:
April 11, 2024
Filing Date:
September 25, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; G01B21/00
Foreign References:
| JP2020127045A | 2020-08-20 | |||
| JP2016105458A | 2016-06-09 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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