Title:
BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/228310
Kind Code:
A1
Abstract:
The present invention suppresses bonding fluctuation to achieve highly stable bonding. In this bonding method: a temperature measurement unit is arranged so that the temperature of a first member and the temperature of a second member can be measured; the temperature measurement unit measures the temperature of the first member and the temperature of the second member while the second member is being irradiated with a laser beam; if the temperature of the second member becomes greater than or equal to a first threshold value, the output of the laser beam is lowered; and after the temperature of the second member becomes at least the first threshold value, if the temperature of the first member becomes greater than or equal to a second threshold value, the output of the laser beam is stopped.
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Inventors:
OGAWA SHOHEI (JP)
YANO YUKI (JP)
YANO YUKI (JP)
Application Number:
PCT/JP2022/021369
Publication Date:
November 30, 2023
Filing Date:
May 25, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K1/005; B23K26/21
Foreign References:
| JP2009539616A | 2009-11-19 | |||
| JP2008177240A | 2008-07-31 | |||
| JPS6343791A | 1988-02-24 | |||
| JP2019130584A | 2019-08-08 | |||
| JP2017051955A | 2017-03-16 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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