Title:
BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/238810
Kind Code:
A1
Abstract:
A bonding method according to the present invention comprises a stacking step and a bonding step. In the stacking step, a first bonding object and a second bonding object are stacked upon each other in such a manner that a heat absorption layer and a bonding material layer are sandwiched between bonding surfaces of the bonding objects. In the bonding step, the heat absorption layer is irradiated with laser light so that the bonding material layer is heated by utilizing the heat that is absorbed from the laser light by the heat absorption layer, thereby bonding the first bonding object and the second bonding object to each other by means of the bonding material layer.
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Inventors:
IKAGAWA YOSHINORI (JP)
Application Number:
PCT/JP2023/020744
Publication Date:
December 14, 2023
Filing Date:
June 05, 2023
Export Citation:
Assignee:
TAZMO CO LTD (JP)
International Classes:
H01L21/02; B23K20/00
Domestic Patent References:
| WO2017195625A1 | 2017-11-16 |
Foreign References:
| JP2013125764A | 2013-06-24 | |||
| JP2011165381A | 2011-08-25 | |||
| JPH0555586A | 1993-03-05 | |||
| JPH02148821A | 1990-06-07 | |||
| JP2001080974A | 2001-03-27 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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